ADT 7100 Dicing Saw

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ADT 7100 Dicing Saw
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Equipment Details
Technology Packaging
Materials Restriction Undefined
Material Processed metals
Sample Size Pieces to 6 inch circular (150 mm)
Equipment Manual
Overview System overview
Operating Procedure SOP
Supported Processes Supported processes
User Processes User Processes
Maintenance Maintenance


The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 150 mm or 6" diameter. It is capable of complex patterns such as multiple indexes and varying cut depths. A specified blade (dependent on substrate type) cuts the workpiece in the specified patterns. The ADT 7100 dicing saw can be used to cut different materials, each of which may need to be processed differently. The process applied to each workpiece is determined by the Recipe assigned. Recipes can be assigned to an individual Workpiece or a series of Workpieces.


Announcements

  • Jan-2021. The chuck has been flattened due to errors encountered by some users. The tool is back to specs and working as expected.
  • Oct-2021. All recipes have been purged. Users now need to export/import their recipes for long-term storage (see detailed SOP).
  • Sep-2021. All recipes have been exported. Users now need to export/import their recipes for long-term storage (see detailed SOP).
  • Aug-2021. A new SOP version is implemented. This version includes more photos and videos showing how to operate the system.
  • Jul-2019. A new logbook format is implemented.
  • Oct-2019. The new computer and software upgrade is complete. Click below to see what's new.
  • Oct-2019. Changes from the upgrade

Capabilities

  • Cut Depth: Depends on the blade and flange diameter. The maximum wafer thicknesses with blades available in the LNF store are:
    • The 00777-1030-008 blade can cut up to 2 mm deep with the 4B785-4200-000 flange.
    • The 00777-1045-008 blade can cut up to 2 mm deep with the 4B785-4200-000 flange.
    • The S1230-Q5HH-000 blade can cut up to ~600 µm deep.
    • The SC-20-Q-D0-DE blade can cut up to ~600 µm deep.
    • The S2550-Q5HH-000 blade can cut up to ~1100 µm deep.
    • The SC-20-Q-D0-HH blade can cut up to ~1100 µm deep.
    • It is possible to cut substrates thicker than 2 mm with larger blades, available by special order.
  • Wafer Size: Up to 6 inches or 150 mm circular. Rectangular substrates must fit inside of the 6 inches or 150 mm circle.

System overview

Tool specifications

Indexing Accuracy: 0.00004 inch or 1.0 µm
Cumulative Accuracy: 0.00006 inch or 1.5 µm
Cut Depth Accuracy: 0.000078 inch or 2.0 µm
Rotary Axis Accuracy: 4 arc-seconds
Chuck Rotation: 0 to 350 degrees
Feed Rate: Up to 13.7 inches/second or 350 mm/second
Return Stroke: 13.7 inches/second or 350 mm/second
Camera Magnification: Up to 120x
Blade Diameter: 2 to 3 inches or 50 to 76 mm
Spindle Speed: Up to 60,000 rpm

Substrate requirements

  • Up to 6" circular wafers.
    • Wafers of any shape that will fit in the 6" circle.
  • Any approved flat material, pieces to whole wafers may be cut. Shapes other than flat pieces may require special mounting.
  • Wafers must be mounted on adhesive tape and a mounting frame.
  • Wafer thickness up to 2 mm with standard blades.

Material restrictions

Samples preparation and post-dicing process cleaning

The samples that have been processed in the ADT 7100 dicing saw are considered "dirty" and not suitable to run in any other system in the cleanroom immediately after. Therefore, the dicing of samples should be one of the last steps in the process flow. The following steps are mandatory if the diced samples need to be further processed in any other system in the main LNF cleanroom. Furthermore, for access to CMOS Clean tools after the dicing saw, see note below in red. for extra measurements.

  • Coat the backside of the substrate with SPR-220 photoresist. At least 3um thickness is recommended.
  • Bake at 115°C for about 2 min.
  • Coat the front side of the substrate with SPR-220 photoresist. At least 3um thickness is recommended.
  • Bake at 115°C for about 2 min.
  • Dice following the standard procedure.
  • Rinse for at least 30 seconds in DI water and remove from tape.
  • Remove PR from diced samples in ROBIN lab Solvent 94
  • Acetone in beaker at least 1 minute
  • IPA in a beaker at least 1 minute
  • Dry (N2 gun)
  • Piranha clean in ROBIN lab Acid bench 92
  • RCA clean in the main cleanroom in the RCA bench 81
  • For samples to be allowed into CMOS Clean tools after dicing, follow the process above and then, in addition, perform a pre-furnace clean in bench PFC 01.

̽For samples to be allowed into CMOS Clean tools, follow the process above and then in addition, perform a pre-furnace clean in PFC-01.

Extra notesː

  • For sapphire samples, follow all procedure steps above, but substitute a 60 second 10:1 HF and SC2 clean instead of Piranha clean in ACID-92. Piranha will roughen sapphire.
  • If you foresee an issue with this procedure/process for your specific samples, you must submit a helpdesk ticket for staff to review.



"'These materials are allowed on the Dicing Saw. Some materials may need a special blade, including materials not noted as such below.'"

  • Aluminum requires a special blade
  • BiTe
  • Fused silica/glass
  • GaAs
  • GaN
  • GaP
  • Glass
  • Hard Alumina
  • InSb
  • Li Niobate
  • PZT
  • Quartz
  • Sapphire
  • SiC
  • Silicon
  • Stainless Steel requires a special blade

Supported processes

Several processes for this tool are supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has several user-created recipes for dicing a wide variety of materials. Some of these recipes are documented on ADT 7100 Dicing Saw User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

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Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Complete the checkout quiz. You may retake as necessary until all answers are correct.
  3. Create a Helpdesk Ticket requesting training. You need to describe your sample (material and geometry) and process flow to assess the requirement better.
  4. A tool engineer will schedule a time for initial training.
  5. You may practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

The Non-Contact Height sensor is cleaned once each week. The cutting water and filters are replaced periodically.

Process name