ADT 7100 Dicing Saw/Processes/GaAs
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|About this Process|
|Equipment||ADT 7100 Dicing Saw|
After loading your recipe with Define Job, Check your recipe for the correct Blade Type, Wafer Shape (Circular or Rectangular), Wafer Diameter (circular), Y and X dimension (rectangular), Wafer Thickness, Depth and Index (the distance between cuts).
|Wafer Thickness||Blade||Spindle Speed||Feed Rate|
|Up to 600 µm with a new blade||K&S G1030-Q5HH-000||27-30 KRPM||2.5-10 mm/sec|
|Up to 600 µm with a new blade||K&S S1230-Q5HH-000||27-30 KRPM||2.5-10 mm/sec|
|Up to 1100 µm with a new blade||K&S S2550-Q5HH-000||27-30 KRPM||2.5-10 mm/sec|
- Kerf Width is typically 50 µm with the K&S S1230-Q5HH-000 blade.
- Kerf Width is typically 42 µm with the K&S G1030-Q5HH-000 blade.
- Kerf Width is typically 80 µm with the K&S S2550-Q5HH-000 blade.
- Minimal chipping.
- The total thickness of the wafer plus all other layers may be no more than the capability of the blade.