CEE 100CB photoresist spinner
|CEE 100CB photoresist spinner|
|Sample Size||pieces up to 6" wafers|
|Chemicals Used||Acetone, IPA|
|Supported Processes||Supported Processes|
The CEE 100CB Spinner is a fully programmable, manual dispense, photoresist spinner located in the main cleanroom at the LNF. It can accept pieces, 4" and 6" wafers. It is located in 1440C.
The CEE 100CB is down from the continuing computer issues on the tool. We are looking into replacing the tool, and it will be unavailable until further notice. All photoresist spinning will have to be at the CEE 200X. If you are spinning LOR, KMPR, or AZ 9260 in the next couple of weeks, make a ticket and we will discuss the procedure with you. If you do not have access to the CEE 200X spinners, make a ticket and we will work to get you access as soon as I can.
If you have any questions or concerns please make a ticket, and we will be happy to help you. We apologize for the inconvenience, and thank you for your patience.
- Up to 5K rpm spin rates
- Hot plate maintained at 115°C
- From 10x10 mm pieces up to 150 mm (6 inch) wafers
- No substrate material requirements
- Available Chucks
- 6" Chuck (Ø 3.75")
- 4" Chuck (Ø 2.25")
- Large Piece Chuck (Ø 0.75")
- Small Piece Chuck (Ø 0.25" - chuck ; Ø 0.375" - O-ring)
The CEE 100CB photoresist spinner is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email email@example.com for any material requests or questions.
There are 10 recipe slots in the software, used as follows:
- 8 fixed spin recipes (recipes 1-8), 1 stripping recipe (recipe 9), 1 manual recipe (recipe 0)
- 4 recipes (1000-4000 rpm) for thin resists (e.g. SPR 220 3.0)
- 4 recipes (1000-4000 rpm) for thick resists (e.g. KMPR 1010)
- Only recipe 0 is allowed to be changed, instructions on how to do so can be found in the SOP
More information on the recipe details can be found in the standard processes document. For more information on photoresist spinning and recommended lithoraphy processes, please read the Lithography page. For information on a specific photoresist, please check the datasheet.
Standard Operating Procedure
- Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
- Practice on the tool with your mentor.
- Read through the User Manual above.
- Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
- Schedule a time for a checkout:
- Create a helpdesk ticket for final confirmation of your checkout appointment.
- Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
The bowl, chucks, and hotplate are cleaned each week during lab clean. The protective lining in the bowl is replaced weekly as necessary.
In the event of a power bump, users may run the startup/shutdown procedure.