CEE Developer 1

CEE Developer 1
CEE Developer Table
Equipment Details
Technology	Lithography
Materials Restriction	General
Material Processed	Photoresist
Sample Size	6", 4", pieces, 5" masks, 4" masks
Chemicals Used	AZ 726
Equipment Manual
Overview	Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
Maintenance	Maintenance

The CEE Developers are used to develop photoresist after it's been exposed to UV light by forming a puddle of developer on the wafer. They can accept pieces, 4" and 6" wafers as well as 4", 5" and 7" mask plates. Due to their automation, they are well suited for highly repeatable puddle developing of photoresist. They are located in 1440C across from the CEE 200X PR Spinners.

Announcements

• None at this time.

Capabilities

• Can develop most common photoresists
  • SPR 220 (3.0)
  • SPR 220 (7.0)
  • Shipley 1813
  • AZ 12XT
  • KMPR 1010
  • KMPR 1025

System Overview

Hardware Details

• Available developer
  • AZ 726
• Spindle
  • 6000 rpm max speed
  • Servo controlled

Substrate Requirements

• Pieces up to 2", pieces smaller than 10mm must be mounted
• 4" wafer
• 6" wafer
• 4" mask
• 5" mask

Material Restrictions

The CEE Developer 1 is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported Processes

The CEE Developer has several recipes available for pieces, 4" and 6" wafers from 10 sec to 160 sec in 10 sec increments. These exist in single puddle (SP) and double puddle (DP). A single puddle dispenses 1 puddle of developer onto the wafer, where as the double puddle adds a second puddle of fresh developer half way through the develop. The recipe name is in a developer_size_SP/DP_time format. The size dictates how much developer it dispenses, and the time is in seconds.

CEE Developer recipe name format

Recipes also exist for developing mask plates exposed on the Heidelberg mask maker. For more process information please see the specific photoresist page (SPR 220, 1800, KMPR).

Standard Operating Procedure

• Standard Operating Procedure
• Troubleshooting

Checkout Procedure

1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
2. Practice on the tool with your mentor.
3. Read through the User Manual above.
4. Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
5. Schedule a time for a checkout:
   1. Find an available time for checkout here.
   2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
   3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
6. Create a helpdesk ticket for final confirmation of your checkout appointment.
7. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.

Maintenance

Twice a week during lab clean the CEE's are cleaned and organized. Also the vacuum fluid trap is routinely emptied.