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Chemical Mechanical Polishing (CMP)

The Strasbaugh 6eC is a standard Chemical Mechanical Polisher, CMP, that also has been modified to offer lapping capabilities. CMP is a process that uses the combination of chemical and mechanical action between the wafer, the pad and the slurry to remove finite amounts of material from the wafer surface. The technique's dependency on the chemical reaction of the slurry and the wafer, makes it a highly selective process. CMP is responsible for vertical integration in the electronic industry, CMP is also called Chemical Mechanical Planarization because it is generally used to planarize the wafer surface after a deposition process.


Write a brief description of what this process is used for and how it works here.


General materials that can be used in this process. Maybe list the ones we have capabilities for in the lab.


List of equipment in the lab that use this process.


List any external references or attachments related to this process.


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