Deep UV SenLights PL16

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Deep UV SenLights PL16
Equipment Details
Manufacturer SenLights
Model PL16
Technology Lithography
Materials Restriction General
Material Processed Photoresist
Sample Size pieces up to a 6" wafer
Gases Used ozone
Equipment Manual
Operating Procedure Equipment Manual

The SenLights PL16 is a Deep UV exposure tool that can be used for ozone cleaning, hard-baking photoresist, and surface treatments. It's especially useful for cleaning very delicate 2D materials since there's no plasma.


  • Surface cleaning via UV-Ozone, especially for delicate 2D materials
  • Polymer etching via ozone
  • Positive photoresist (novolac based) crosslinking via deep UV exposure
  • PDMS Surface Modification
  • Surface prep for low temp fusion bonding

System overview

Hardware details

  • Aprox. 15 mW/cm2 at 30mm of 254nm light
  • 185nm light for ozone generation
  • Low concentrations of ozone in the range of 20-200ppm

Substrate requirements

  • Pieces to a 150mm wafer, up to 70mm thick

Material restrictions

The Deep UV SenLights PL16 is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email for any material requests or questions.

Equipment Manual

Equipment Manual

Process Info

Etch Rate

This is an isotropic etch that's highly dependent on localized loading. Small isolated features can etch around 2-4X faster then a blanket film.

  • 100mm wafer of blanket SPR 955: ~100 nm/hr

Etch Rate Overview

Improve Wet Etch Undercut

  • After developing SPR 955 run for 5min with 1cm gap.

Below shows the difference in undercut of a 15min BHF etch of SiO2 using SPR 955 as a mask.

Improved BHF undercut on SiO2 etch

Fully cross-link SPR 955

  • After developing SPR 955 run for 5min with 1cm gap
  • Bake at 180C for 30 min

Below shows SPR 955 that's been fully cured, then a second layer patterned on top of it. This document goes through the development of this cross-link bake and some process testing with it. The bake generates a lot of stress and will typically cause thicker (3µm+) films to partially fail. SPR 955 Cross-link

SPR 955 Litho Cure Litho.jpeg SPR 955 Litho Cure Litho 2.jpeg

Checkout procedure

  1. Read through this page and the Equipment Manual
  2. Complete the SOP quiz
  3. Create a Helpdesk Ticket requesting checkout.


The etch rate of a 100mm Si wafer coated with SPR 955 is monitored on an approximately monthly basis, the log can be viewed at the tool.