E-Beam Spinner/Hot-Plate Bench 21
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E-Beam Spinner Hot-Plate Bench 21 | |
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Equipment Details | |
Technology | Wet chemical processing |
Materials Restriction | Metals |
Material Processed | PMMA, ZEP, HSQ, E-Spacer, aquaSAVE |
Sample Size | 10 mm X 10 mm piece parts to 4" wafers |
Equipment Manual | |
Overview | System Overview |
Operating Procedure | SOP |
Supported Processes | Supported Processes |
User Processes | User Processes |
Maintenance | Maintenance |
The E-Beam Spinner Hot-Plate Bench 21 is a fully programmable, manual dispense, e-beam resist spinner located in 1480A. It can accept 10 mm X 10 mm pieces to 4" wafers.
Contents
Capabilities
Available e-beam resists: PMMA, ZEP
For all other resists, please see the Private Chemical Policy
System overview
Hardware details
- Up to 6K rpm spin rates
- Hot plate preset at 180°C
- Photoresist is dispensed manually
Substrate requirements
- 10 mm x 10 mm pieces up to 4" wafers
- No substrate material requirements
- Available Chucks
- 4" Chuck (Ø 2.25")
- Large Piece Chuck (Ø 0.75")
- Small Piece Chuck (Ø 0.25" - chuck ; Ø 0.375" - O-ring)
Material restrictions
Approved resists
- PMMA
- ZEP
- HSQ
Supported processes
Listed below are the Film Thicknesses vs spin Speed for commonly used e-beam resists at LNF
Standard operating procedure
Widget text will go here.
Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- If your mentor is not an authorized user or you do not know of an authorized user that can train you, proceed to the next step.
- Score 100% on this quiz: Cleanroom Solvent Bench quiz.
- Open a helpdesk ticket and request a checkout.
- A tool engineer will schedule a time for training and checkout.
Maintenance
Once a week during lab clean the E-Beam Spinner/Hot-Plate Bench 21 is cleaned and the spinner bowl liner is checked/ replaced if necessary