Facility description for proposals

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This page describes the LNF capabilities. Feel free to use as needed when preparing a proposal making use of the LNF. If you have more questions or need more details, please contact the LNF managing director sandrine@umich.edu.

If you need a pdf version of the information below, it is available at this link


The 13,500 sq.ft. Lurie Nanofabrication Facility (LNF) offers complete capabilities for fabrication and characterization of MEMS/NEMS and microfluidic systems, including bulk Si micromachining, surface micromachining, electroplating, and wafer bonding. In addition, comprehensive fabrication capabilities for optical and e-beam lithography, direct write and printing techniques, thin-film deposition, chemical vapor deposition, oxidation/doping/diffusion, lapping/polishing are available to the whole user community. The facility also provides users with the flexibility to work with many non-Si materials for quantum devices, nanophotonics, advanced electronic devices and circuits, organic electronics. Most equipment can handle samples from small pieces up to 150mm diameter samples. Twenty technical staff members support the LNF facilities, programs and user community, and provide expertise in e-beam lithography, wafer bonding, chemical vapor deposition, process integration, microfluidics, soft lithography, plasma etching, DRIE and advanced material and structure characterization. This includes Ph.D. staff members who have experience in nanofabrication, bioMEMS and integrated microsystems, photonics, surface science and nanomaterials, and whose primary function is to assist and support the user community with their research projects. The LNF also include office, general computing and collaboration space for use by external users when they are onsite. External users have access to the necessary support (storage, local housing, transportation assistance etc) that they need outside of LNF.


Technology Instruments and capabilities
Contact Lithography 5 Contact aligners min feature ~ 1.5µm backside alignment capability, bond alignment
Projection Lithography i-line stepper min feature ~ 0.5µm (10mm square pieces up to 150mm substrate capability)
E-Beam Lithography JEOL JBX6300-FS E-Beam, min feature 8nm, compatible with curved and transparent substrates
Other Lithography Automated photoresist coat/develop (cassette-to-cassette and single stations), Image reversal

Dip Pen Nanolithography
Inkjet printing

Mask Making Direct write mask maker and laser writing (1µm)
Diffusion/ Oxidation/ Doping/ Annealing 9 Furnace tubes: Diffusion/ Dry and Wet oxidation/ Annealing, Sintering, CNT/graphene

n- and p-type doping, n- and p-type anneal & oxidation/
2 Rapid Thermal Process

LPCVD/ PECVD/ CVD 14 Furnace tubes for LPCVD (low and high temperature SiO2, Si3N4, SiOxNy, low stress SiN, undoped polySi, n- and p-type in-situ doped polySi , PSG, TEOS)

2 PECVD systems +1 AMAT cluster tool (SiO2, Si3N4, SiOxNy, amorphous silicon with n- and p- type doped, intrinsic capability, TEOS)
CVD for nanowires

Thin-Film Deposition 10 PVD Systems for Metals (Ag, Al, Al 0.5% Si, Al 1% Si, Al 2% Si, Au, Cr, Co, Cu, Fe, In, Ir, Mo, Ni, Ni-Cr, Pd, Pt, Sn, Ta, Ti, W-Ti, W, Zn), Metal Oxides (AZO, IGZO, ITO, V2O5, ZnO), Dielectrics (AlN, Al2O3, C, SiO, SiO2, Si3N4, Ta2O5, TiN, TiO2), Compounds (MgF, ZnSe) and Semiconductors (Ge, Si)
Atomic Layer Deposition Aluminum Oxide and Hafnium Oxide
Dry Etching 3 RIE + 1 AMAT cluster tool (silicon, SiO2, SiOxNy, Si3N4, AlN, Al2O3, III-V, parylene, PDMS, glass, metals)

2 DRIE of silicon and PZT
DRIE of glass, oxide, quartz, SiC
XeF2 etching of silicon
Photoresist ashers, Wax etching, Plasma cleaner

General Wet Processing 16 Wet processing benches for acid, base and solvent, Wafer clean (piranha, ionic, RCA), soft lithography (SU-8, PDMS)
Electroplating Cu, Au, Ag, Pt, Ni, Fe-Ni, In
Dedicated Wet Etching EDP, KOH, TMAH, and HF/HNO3
Wafer Bonding 3 Bonders for direct, Si-Si fusion, eutectic, polymer, anodic, thermo-compression

2 Bond aligners, plasma surface activation, surface cleaner

Other Process Capabilities Critical point dryers, rinser/dryers, Organic processing, CO2 snow cleaners, Bake ovens, Programmable curing oven (vacuum, inert, oxidative or reducing atmosphere)
AFM TUNA, surface potential (Kelvin probe), magnetic force, piezo-materials characterization, electrical mapping.
SEM Analytical, large prechamber (6”wafer), XEDS
Other Metrology Optical and mechanical profilometers, Wafer stress measurement, Ellipsometer (incl spectroscopic), Optical interferometers, 4-Point probe, Laser interferometer, Confocal microscope, Fluorescent microscope, Goniometer, microFTIR
Polishing and Packaging Lapping

Chemical Mechanical Polishing of silicon, silicon oxide, silicon nitride, metals (Ni, Cu, NiP).
Post CMP cleaning
Flip-Chip Bonder, Wire Bonder

Bio Safety Level 2 Lab UV light, Waste handling, Bio safety cabinet, CO2 incubator, Mixer, centrifuge, Substrate cleaning (piranha, plasma, CO2 snow), Biofreezer