Four Point Probe Four Dimensions 280DI
Four Point Probe Four Dimensions 280DI | |
---|---|
Equipment Details | |
Technology | Metrology |
Materials Restriction | General |
Sample Size | Pieces (of min dimension 1cm x 1cm) up to 8" wafers |
Equipment Manual | |
Overview | System Overview |
Operating Procedure | SOP |
Supported Processes | Supported Processes |
User Processes | User Processes |
Maintenance | Maintenance |
The Four Point Probe Four Dimensions 280DI is an automated four point probe system that is used to measure resistive properties of semiconductor wafers and thin films.
Contents
Announcements
- System released for use on 12/20/24. Tool is interlocked and requires training before use. Please submit a Helpdesk ticket through LNF Online Services scheduler page for the tool to request training/checkout session.
Capabilities
- Sheet resistance range of 1E-2 to 8E11 ohms/sq according to vendor tool specification
System overview
Hardware details
Substrate requirements
- Sample Size from pieces (of minimum dimension 1cm x 1cm) up to 8" wafers
- Maximum sample thicknesses of up to 1mm
Material restrictions
The Four Point Probe Four Dimensions 280DI is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Four Point Probe Four Dimensions 280DI user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
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Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Create a Helpdesk Ticket requesting training.
- A tool engineer will reply to your Helpdesk ticket to arrange a time for training and checkout.
Maintenance
- Probe head replaced as needed
Process name