Glass Frit bonding

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Glass Frit bonding
Technology Details
Other Names glass soldering, seal glass bonding
Technology Substrate bonding
Equipment List of glass Frit bonding equipment
Materials %Optional materials processed%
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Glass Frit bonding involves patterning of low melting glass onto the bonding surfaces. This results in structures that are subsequently heated and fused when the two substrate surfaces are placed in contact. On cooling, a mechanically stable bond results.

See Reactive ion etching and Plasma etching for an example.

Method of operation

Low melting point glass frit is patterned onto substrate. Substrates are aligned and then placed in bonder. Temperature is raised to burn out and firing and then pressure is applied. Finally the sample is cooled to complete the bonding process.

Applications

Used to bond two substrates together. Frequently used in MEMS applications for encapsulation. The ability to bond over rough surfaces, selectively bond, lower bond temperatures, no electric potentials, and lack of out gassing are advantages over other types of bonds.

Parameters

Here we describe what parameters are of importance in this technology (e.g. power, temperature...). May not be relevant to some technologies.

Parameter 1

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Subtechnology 1

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Materials

Optional description of materials that can be processed by technology. I think the best example of where this comes in handy would be with LPCVD describing the difference between HTO and LTO.

Equipment

If this is a "main category" for equipment (i.e. you categorized that equipment page to be this technology), you should list the equipment here with a brief description of that tool's capabilities. Seriously, though, just check out the RIE page.

Equipment 1

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Brief description of that piece of equipment.

Complete tool list


See also

Other related wiki pages

References


Further reading

  • Other stuff, e.g. technology workshop slides
  • External links (can be in another section below, if appropriate)