Laser Lith Heidelberg DWL66+

Laser Lith Heidelberg DWL66+
Equipment Details
Technology	Lithography
Materials Restriction	General
Material Processed	SPR 220-3.0, SPR 955, S1813, AZ5214, SPR 220-7.0, AZ 12XT, SC 1827
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
User Processes	User Processes
Maintenance	Maintenance

The Laser Lith Heidelberg DWL66+ is a high-resolution direct-write pattern generator. As an all-rounder, the DWL 66+ is ideal for research and development (R&D) in microelectronics, MEMS, microfluidics, sensors, non-standard substrates, advanced packaging — virtually any academic application that requires microstructure fabrication. The DWL 66+ stands out with its Grayscale Exposure Mode, which creates complex 2.5D microstructures such as micro-optics for mobile applications, diffractive optical elements (DOE), computer-generated holograms, and structured surfaces.

Announcements

The DWL66+ operates in Mode III (10mm) with calibrated frontside alignment by default. Access to High-Res Mode and Mode V (40 mm) is available upon request, as outlined below:

High-Res Mode availability: Monday 10:00 AM – Tuesday 10:00 AM - Request by: Friday 6:00 PM

V Mode availability: Thursday 4:00 PM – Friday 4:00 PM - Request by: Wednesday 4:00 PM

When a mode is requested, the write head will be changed and remain in that mode for the scheduled day. If you plan to use the alignment process, please note that in your reservation info or in your ticket.

Calendar Link

Capabilities

The LNF Heidelberg DWL66+ system is configured with a 405 nm laser and four writing heads (40 mm, 40 mm-BFF, 10 mm, and HiRes). The following table summarizes the technical specifications provided by the manufacturer. However, final results are photoresist and sample dependent.

Write Mode	HiRes	III	V
Writting head	HiRes	10mm	40mm
Minimum Feature Size (µm) Noteː This is resist dependent	0.3	1	4
Minimum Lines and Spaces (µm)	0.5	1.5	5
Address Grid (nm)	5	50	200
Edge Roughness (3σ, nm)	50	80	160
CD Uniformity (3σ, nm)	60	130	250
2nd Layer Alignment over 5 x 5 mm2 (nm)	250	250	500
2nd Layer Alignment over 100 x 100 mm2 (nm)	350	350	800
Backside Alignment (nm)	1000	1000	-
Write Speed (mm2/min)	3	150	2000
Exposure Time for 100 x 100 mm2 area (min)	3000	72	7

System overview

Hardware details

• Environmental enclosure for temperature stability
• Base granite with air cushions for vibration isolation
• Optical system including highly reflective mirrors and acousto-optic modulators for real time beam correction
• Stage system with linear motors, position control by interferometer, and vacuum chuck for various substrate sizes
• Overview camera with 8 x 10 mm field of view
• Integrated camera for substrate inspection and automatic alignment

Substrate requirements

• Maximum substrate size 9" x 9"
• Minimum substrate size 5mm x 5mm
• Maximum write area 200mm x 200mm
• Substrate thickness 0 to 12mm

Material restrictions

LNF approved photoresists such as S1813, AZ5214, SPR-220, SPR-955, etc.

Antireflective coatings may be used

If you need to use a particular resist that is not listed here, please contact the tool engineer via the Helpdesk Ticket system

Recommended exposure parameters

The exposure parameters are photoresist and sample-dependent. You can see below some of the recommended values for typical samples. It is encouraged that each user verify these values for specific samples. UPD: 2025-12-02

LNF store photomasks

The recommended development of the LNF photomasks is for forty seconds with developer AZ-726 in the CEE developers with recipe AZ-726̠ SP-40.

Writing head	HiRes	10mm	40mm
Laser power	70mW	60mW	190mW
Filter	1%	25%	100%
Intensity	50%	55%	100%
Defocus	0%	5%	0%
CD bias	*	*	*
Exposure passes	1	1	1
y-speed	1	1	1

SPR-955-0.95um on Si

These parameters are based on our standard process guidelines for SPR 955

Writing head	HiRes	10mm	40mm
Laser power	?	80mW	?
Filter	?	50%	?
Intensity	?	50%	?
Defocus	?	0%	?
CD bias	*	*	*
Exposure passes	?	1	?
y-speed	?	1	?

SPR-220-3um on Si

These parameters are based on our standard process guidelines for SPR 220

Writing head	HiRes	10mm	40mm
Laser power	?	150mW	260mW
Filter	?	100%	100%
Intensity	?	45%	100%
Defocus	?	0%	0%
CD bias	*	*	*
Exposure passes	1	1	2
y-speed	1	1	0.5

SPR-220-5um on Si

These parameters are based on our standard process guidelines for SPR 220

Writing head	HiRes	10mm	40mm
Laser power	?	160mW	?
Filter	?	50%	?
Intensity	?	80%	?
Defocus	?	0	?
CD bias	*	*	*
Exposure passes	?	1	?
y-speed	?	1	?

CD Biɑs

* The Critical Dimension (CD) bias is photoreist, feature type, and sample dependent. It is recommended to test the CD bias for your specific sample. The LNF staff has done some preliminary characterizations that you can review here.

Standard operating procedure

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Checkout procedure

1. Read through this page and the Standard Operating Procedure above.
2. Create a Helpdesk Ticket requesting training.
3. A tool engineer will schedule a time for initial training.
4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
5. Take and score 100% on the SOP quiz.
6. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.