In/Au bonding/Processes

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About this Process
Process Details
Equipment	In
Technology	[[]]

In/Au Eutectic Bonding is a eutectic system describes a homogeneous solid mix of atomic and/or chemical species, to form a joint super-lattice, by striking a unique atomic percentage ratio between the components — as each pure component has its own distinct bulk lattice arrangement. It is only in this atomic/molecular ratio that the eutectic system melts as a whole, at a specific temperature (the eutectic temperature) the super-lattice releasing at once all its components into a liquid mixture. The eutectic temperature is the lowest possible melting temperature over all of the mixing ratios for the involved component species. The coordinates defining a eutectic point on a phase diagram are the eutectic percentage ratio (on the atomic/molecular ratio axis of the diagram) and the eutectic temperature (on the temperature axis of the diagram).[2] Not all binary alloys have eutectic point

Eutectic alloy	Eutectic composition in wt%	Eutectic temperature ⁰C	Pure component melting point ⁰C
Au-In	0.6/99.4
Au-Si	97.15/2.85	row 2, cell 2	row 2, cell 3
Al-Ge	49/51
Al-Si	87.5/12.5
Au-Sn	80/20
Cu-Sn	5/95
Au-Ge	72/28

Eutectic alloy Eutectic composition in wt% Eutectic temperature ⁰C Pure component melting point ⁰C Au-In 0.6/99.4 156 Au=1,064 - In=156.61 Au-Si 97.15/2.85 370 Au=1,064 - Si=1,414 Al-Ge 49/51 419 Au=1,064 - Ge=938.25 Al-Si 87.5/12.5 580 Au=1,064 - Al=660.32 Au-Sn 80/20 280 Au=1,064 - Sn=231.93 Cu-Sn 5/95 231 Cu=1,084.6 - Sn=231.93 Au-Ge 72/28 361 Au=1,064 - Ge=938.25

Procedure

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