MA6 Mask Aligner

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MA6 Mask Aligner
Equipment Details
Technology Contact Lithography
Materials Restriction General
Material Processed Photoresist
Mask Materials 4", 5", 7" mask plates
Sample Size 4" and 6" wafers
Chemicals Used LNF approved photoresists
Equipment Manual
Overview System Overview
Operating Procedure Topside Mask Alignment SOP

The MA6 Mask Aligner is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure.


  • 2 µm min feature size resolution in thin resist
  • Aspect Ratio 1:3 fairly standard
  • Substrate thickness 200 µm to 4 mm possible

System overview

Hardware Details

  • Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose about 30 mJ/sec
  • 4" and 6" chucks
  • 4", 5" and 7" mask holders
  • Flood exposure, soft, hard, and vacuum contact capable
  • Topside alignment (no backside or bond alignment)
  • 10 mm stage travel, 150 mm microscope objective travel with split field view camera option

Substrate requirements

  • Full 4" and 6" wafers standard
  • Pieces are not allowed in this mask aligner. For pieces use MJB3 instead
  • Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
  • Substrate thickness up to 4 mm possible
  • Minimum substrate thickness is different for each chuck. Consult the chart below, and if your substrate is less than the listed minimum please make a ticket
Chuck Minimum Thickness
4in Black 450µm
4in Vacuum 350µm
6in BA 480µm
6in 420µm

Material restrictions

Allowed Materials - LNF approved photoresists

Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)

Supported processes

This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <5% uniformity across the 4” area. The 365 peak output is about half of this and tracks very well however is not routinely calibrated. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or a manually timed flood exposure.

Exposure of all LNF approved photoresists are allowed on this tool, for data on specific resist please see that resists wiki page.

Standard operating procedure

Checkout procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Practice on the tool with your mentor.
  3. Read through the User Manual above.
  4. Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
  5. Schedule a time for a checkout:
    1. Find an available time for checkout here.
    2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
    3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
  6. Create a helpdesk ticket for final confirmation of your checkout appointment.
  7. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.