MPP iBond 5000 Ball Bonder
| MPP iBond 5000 Ball Bonder | |
|---|---|
 | |
| Equipment Details | |
| Technology | Packaging |
| Materials Restriction | Metals |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
The MPP iBond 5000 Ball Bonder is a wire bonder that is designed to connect bond pads on a device to the leads of a package such as DIP or TO-5 cases. It can also be used to interconnect bond pads between two devices, the same device, or to a printed circuit board. The Ball Bonder offers control of individual bond parameters and programmable loop formation.
Contents
Announcements
- The ball bonder will be released for training soon.
Capabilities
Ball bonding is normally done with gold wire. Aluminum is not used.
Several processes are available in addition to standard ball bonding. The LNF does not provide special tools at this time.
- Ball Bumping
- Single point TAB (Tape-Automated Bonding, requires a special tool)
- Coining (requires a special tool)
- Security Bond
Several bond modes are available.
- Thermocompression Bonding: Only heat and pressure are used to perform bonds. This works best with gold wire.
- Ultrasonic Bonding: Pressure and ultrasonic energy are used to perform bonds.
- Thermosonic Bonding: Both heat and ultrasonic energy with pressure are used to perform bonds.
Two modes of operation are available.
- Multi-Mouse mode (semi automatic)
- Bonding heights (1st search, loop and 2nd search) are preset using controls on the panel. This allows rapid bonding of pads that are the same height.
- Manual Z mode
- Bonding heights are achieved with the manual Z lever. This allows for a wide range of bond pad heights. Normally used when the first bonds or seconds bonds are not consistent in height. It is also used when there are only a few bonds per device.
System overview
Hardware details
Wire for ball bonding available at the LNF.
- Gold: 1 mil (25.4 μm) diameter.
Tool features
- 7” TFT Touch Screen Management.
- Load/Store wire bonding profiles (recipes).
- Semi automatic/Manual Z mode.
- Better clearance for deeper access as compared to the wedge bonder.
- Consistent ball size via Negative Electronic Flame-Off.
- Missing ball detection and auto-stop.
- Mouse Ratio 6:1 (Choose Mouse Type).
- Spotlight targeting.
- Video monitor.
- Bonding area: 6" x 6" (150 mm x 150 mm).
- Workholder temperature controller.
Substrate or package requirements
- Wafer or Package Size
- The clamp workholder can accommodate thin samples up to 2” X 2”, flat or DIP.
- The vacuum workholder can accommodate smaller and thicker workpieces. Larger workpieces can be used with limitations.
- Wafer thickness
- For the clamp workholder, the device or package must be thin enough to fit under the workholder clamps.
- Bond Pads
- Bond pads should be at least 75 µm square to make is easier to place the bond. Larger pads are better. Bond size should not exceed 75% of the bond pad size.
- Gold or Aluminum pads provide the most reliable bonds. Platinum and Copper can also be bonded.
- Metal adhesion must be good enough to prevent lifting of the pad metal at the bond point. Use adhesion layers. The requirements vary between substrate materials.
- Thicker metal will allow for more reliable bonding.
- A minimum of 0.76 micron of soft gold on an interface material such as 5 micron nickel works well for bondability and to minimize pad damage. Thicker is better. There has been limited success with thinner layers.
- For aluminum, 0.8 micron pad thickness is recommended, 3 microns for higher reliability.
- All metal surfaces must be clean. There may not be any contamination such as oils, glue, oxides or corrosion. Solvent or plasma cleaning shortly before bonding is recommended.
- Critical requirements
- The device to be bonded must be mounted on a solid surface using a hard material. For example, mounting with soft tape will reduce the effectiveness of the ultrasonic energy. If the device is large enough to be placed directly on the workholder, no special mounting is necessary. Use vacuum or both workholder clamps to ensure that the entire device/package is in contact with the workholder surface. For gold, the workpiece should be heated to about 150 degrees C. Mounting material must be able to withstand this temperature. Crystal bond will melt. High temperature silver or graphene conductive epoxy is available.
Materials Compatibility
These materials can be bonded on the LNF Wire bonder.
- Aluminum
- Gold
Other more difficult materials
- Copper (difficult to keep clean enough to bond. Coatings can help.)
- Platinum (Needs to be heated)
Materials Restrictions
The following materials are allowed to be in the system.
- CMOS-compatible materials such as Si, SiO2, Si3N4.
- Metals compatible with wire bonding such as Au, Ag, Ni, Al, Ti, Cr, etc.
- Fully cured (LNF approved) photoresists and polymers as long as they are kept out of contact with the capillary.
- Semiconductors and dielectrics already approved in other LNF tools categorized as "General".
Supported processes
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on MPP iBond 5000 Ball Bonder user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
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Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Practice with your mentor, or create a Helpdesk Ticket requesting training.
- You may practice with your mentor or another authorized user until you are comfortable with tool operation.
- Take and pass the Ball Bonder Quiz.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
