MPP iBond 5000 Wedge Bonder

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MPP iBond 5000 Wedge Bonder
Equipment Details
Technology Packaging
Materials Restriction Undefined
Equipment Manual
Overview System overview
Operating Procedure SOP
Supported Processes Supported processes
User Processes User Processes
Maintenance Maintenance

The MPP iBond 5000 Wedge Bonder is a wire bonder that is designed to connect bond pads on a device to the leads of a package such as DIP or TO-5 cases. It can also be used to interconnect bond pads between two devices, the same device, or to a printed circuit board. The Wedge Bonder offers control of individual bond parameters and programmable loop formation.


  • The tool has been installed and added to the scheduler. If you require training, please create a helpdesk ticket.


Several bond modes are available.

  • Thermocompression Bonding: Only heat and pressure are used to perform bonds. This works best with gold wire.
  • Ultrasonic Bonding: Pressure and ultrasonic energy are used to perform bonds.
  • Thermosonic Bonding: Both heat and ultrasonic energy with pressure are used to perform bonds.

Two modes of operation are available.

  • Multi-Mouse mode (semi automatic)
    • Bonding heights (1st search, loop and 2nd search) are preset using controls on the panel. This allows rapid bonding of pads that are the same height.
  • Manual Z mode
    • Bonding heights are achieved with the manual Z lever. This allows for a wide range of bond pad heights. Normally used when the first bonds or seconds bonds are not consistent in height. It is also used when there are only a few bonds per device.

System overview

Hardware details

Four types of wire are available at the LNF.

  • Aluminum: .7 mil (17.78 μm) diameter.
  • Aluminum: 1 mil (25.4 μm) diameter.
  • Gold: .7 mil (17.78 μm) diameter.
  • Gold: 1 mil (25.4 μm) diameter.

Tool features

  • 7” TFT Touch Screen Management.
  • Load/Store wire bonding profiles (recipes).
  • Semi automatic/Manual Z mode.
  • Mouse Ratio 6:1 (Choose Mouse Type).
  • Table tear or clamp tear wire termination.
  • Advanced Wedge Automatic Wire Re-Feed.
  • Spotlight targeting.
  • Video monitor.
  • Bonding area: 5.3" x 5.3" (135 mm x 135 mm).
  • Workholder temperature controller.

Substrate or package requirements

  • Wafer or Package Size
    • The clamp workholder can accommodate thin samples up to 2” X 2”, flat or DIP.
    • The vacuum workholder can accommodate smaller and thicker workpieces. Larger workpieces can be used with limitations.
  • Wafer thickness
    • For the clamp workholder, the device or package must be thin enough to fit under the workholder clamps.
  • Bond Pads
    • Bond pads should be at least 75 µm square to make is easier to place the bond. Larger pads are better. Bond size should not exceed 75% of the bond pad size.
    • Gold or Aluminum pads provide the most reliable bonds. Platinum and Copper can also be bonded.
    • Metal adhesion must be good enough to prevent lifting of the pad metal at the bond point. Use adhesion layers. The requirements vary between substrate materials.
    • Thicker metal will allow for more reliable bonding.
    • A minimum of 0.76 micron of soft gold on an interface material such as 5 micron nickel works well for bondability and to minimize pad damage. Thicker is better. There has been limited success with thinner layers.
    • For aluminum, 0.8 micron pad thickness is recommended, 3 microns for higher reliability.
    • All metal surfaces must be clean. There may not be any contamination such as oils, glue, oxides or corrosion. Solvent or plasma cleaning shortly before bonding is recommended.
  • Critical requirements
    • The device to be bonded must be mounted on a solid surface using a hard material. For example, mounting with soft tape will reduce the effectiveness of the ultrasonic energy. If the device is large enough to be placed directly on the workholder, no special mounting is necessary. Use vacuum or both workholder clamps to ensure that the entire device/package is in contact with the workholder surface. For gold, the workpiece should be heated to about 150 degrees C. Mounting material must be able to withstand this temperature. Crystal bond will melt. High temperature silver or graphene conductive epoxy is available.

Material restrictions

These materials have been bonded successfully on the LNF Wire bonder.

  • Aluminum
  • Gold

Other more difficult materials

  • Copper (difficult to keep clean enough to bond. Coatings can help.)
  • Platinum (Needs to be heated)

Supported processes

Wire bonding is commonly made to Aluminum and Gold bond pads. We have Gold and Aluminum wire. Other materials require special consideration. Some of the materials that have been bonded on this tool are described in more detail on the Processes page.

Standard operating procedure

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Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Practice with your mentor, or create a Helpdesk Ticket requesting training.
  3. You may practice with your mentor or another authorized user until you are comfortable with tool operation.
  4. Take and pass the Wedge Bonder Quiz.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Further reading