nP12 nanoPREP

NP12 nanoPREP
Equipment Details
Technology	Plasma activation
Materials Restriction	Semi-Clean
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
User Processes	User Processes

The nP12 is an atmospheric plasma tool that generates a N₂ plasma which scans over the wafer surface. It is used for wafer surface modification, usually plasma activation prior to wafer bonding. Plasma activation helps to reduce the necessary bonding temperatures in many materials and enables fusion bonding of si substrates.

Capabilities

• 500 W direct N₂ plasma
• Programmable scan speed and dose
• Adjustable for various substrate thicknesses up to several mm
• Wafers from 10 mm pieces up to 300 mm diameter

System overview

Hardware details

• N₂ plasma
• Plasma scan of substrate surface is at atmosphere
• Programmable plasma power

Substrate requirements

• 10 mm pieces up to 300 mm diameter wafers
• Mounting may be advisable. Discuss with a tool engineer
• 3 mm max thickness

Material restrictions

The NP12 nanoPREP is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

This tool is primarily used to plasma activate the surface of Si substrates for direct wafer bonding, however it will perform surface modification of many materials.

Standard operating procedure

SOP

Checkout procedure

1. Read through this page and the SOP
2. Create a Helpdesk Ticket requesting training/checkout.
3. A tool engineer will schedule a time training/checkout.