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Phosphoric acid is a weak acid with the chemical formula H3PO4. It is often used to etch Silicon nitride. Phosphoric acid is commonly encountered as an 85% aqueous solution. In appearance, it is a colourless, odourless, and non-volatile viscous liquid. Phosphoric acid will severely irritate the skin and damage the eyes.
Phosphoric acid can be used at the following benches
Phosphoric acid is stored in the passthroughs in
- Hot Phosphoric Acid for Etching Silicon Nitride
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- Acid Bench 02 SOP has information about the tank of phosphoric acid in the lab.
- According to "Etch Rates for Micromachining Processing Part II" by Williams, phosphoric acid at 160C will have an etch rate of 4.5 nm/min.
Never aspirate or drain a liquid that is heated. Wait til the solution has cooled to room temperature before disposing. Phosphoric acid can go down any drain that has an acid waste neutralization system.
Technical Data Sheet
- There are currently no data sheets for this chemical.
Safety Data Sheet
- KR Williams, K Gupta, M Wasilik, "Etch Rates for Micromachining Processing - Part II", JMEMS vol. 12 No 6, Dec 2003
- Vossen, John L., and Werner Kern. Thin Film Processes. Academic Press, 1991.