Plasmatherm 790/Processes

This page lists the processes supported by the LNF for the Plasmatherm 790.

Process List

RIE

• Plasmatherm 790/Processes/m_si_o_1

  A silicon dioxide etch.

• Plasmatherm 790/Processes/m-si-n-1

  A silicon nitride etch.

• Plasmatherm 790/Processes/m_pary1

  An O₂ etch for parylene and other polymers.

• Plasmatherm 790/Processes/L_O2_DSM

  A photoresist descum

PECVD

The Plasmatherm has 3 oxide recipes available, at 200°C, and 350°C.

• Plasmatherm 790/Processes/L_ox200
• Plasmatherm 790/Processes/L_ox350
• Plasmatherm 790/Processes/L_ox350R (slightly lower roughness)

There are also 2 nitride recipes available, at 200°C, and 350°C. These have the index and stress optimized.

• Plasmatherm 790/Processes/L_nit200
• Plasmatherm 790/Processes/L_nit350

Then there is also 1 oxynitride recipe at 350°C. It is designed to have minimal stress.

• Plasmatherm 790/Processes/L_oxy350

There is also DBR_N_O which has 4 deposition steps consisting of L_NIT200,L_OX200,L_NIT200,L_OX200