Plasmatherm 790/Processes/L nit350

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l_nit350 is a higher temp nitride deposition recipe for the Plasmatherm 790. It is optimized to have a stress near 25 MPa and an index of 2.0.

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Capabilities

Parameter
Deposition Rate 27.9 nm/min
Index of Refraction 1.999
Stress 10 MPa

Qualification is done with a 5 minute run, max allowed thickness of 2µm.

Parameters

Parameter Dep
RF Power 150 W
Pressure 1500 mTorr
NH3 Flow 1.43 sccm
N2 Flow 160 sccm
He Flow 490 sccm
SiH4 Flow 5 sccm
Temperature 350°C