Plasmatherm 790/Processes/L ox350R
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L_OX350R is a 350 C oxide deposition recipe designed to reduce the film roughness by increasing the power. Currently more characterization is needed but roughness as low as 0.23 nm have been seen.
|About this Process|
|Gases Used||SiH4, N2O, He|
|Deposition Rate||6.5 Å/sec|
|Index of Refraction||?|
Qualification is done with a 5 minute run, max allowed thickness of 2µm.
|RF Power||150 W|
|SiH4 Flow||3.0 sccm|
|N2O Flow||200 sccm|
|He Flow||100 sccm|