Plasmatherm 790/Processes/m pary1

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m_pary1 is an O₂ etch that can be used for parylene and other polymers.

About this Process
Process Details
Equipment	Plasmatherm 790
Technology	RIE
Material	Parylene
Mask Materials	Photoresist
Gases Used	O₂

Contents

1 Parameters
2 Capabilities
- 2.1 Etch Rate
- 2.2 Mask Selectivity
3 Limitations

Parameters

Parameter	Etch
RF Power	105 W
Pressure	100 mTorr
O₂ Flow	99 sccm

Capabilities

Etch Rate

Parylene Etch Rate: 2000 Å/min
SPR 220: 2000 Å/min

Mask Selectivity

Si Etch Rate: <5 Å/min
SiO2 Etch Rate: <5 Å/min

Limitations

The limitations for this recipe are still being defined.

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