Pyrex

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Pyrex is a form of borosilicate glass with low thermal expansion. National Institute of Standards and Technology (NIST) describes borosilicate Pyrex as being composed of (% wt): 4.0% boron, 54.0% oxygen, 2.8% sodium, 1.1% aluminum, 37.7% silicon, and 0.3% potassium.

Equipment

Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.

Deposition Equipment

• Pyrex can be used as a substrate in many tools in the lab.

Etching Equipment

• Wet Etching
  • Acid Bench 12
  • Solvent Bench 14
  • E-Beam Solvent Bench 22
  • Acid Bench 73
  • RCA Bench 81
  • Acid Bench 82
  • Solvent Bench 83
  • Solvent Bench 84
  • Acid Bench 92
  • Solvent Bench 94
• RIE
  • STS APS DGRIE
  • STS Pegasus 4
  • STS Pegasus 6
  • Nanoquest II Ion Mill
  • LAM 9400

Characterization Equipment

• Metrology/Characterization equipment available in the LNF for measuring physical, optical, and surface properties of this material.

Applications

• Borosilicate glass has many applications in the LNF. The LNF supplies:
  • beakers and crystallizing dishes - they are resistant to chemicals and can handle heating
• Glass is also a common substrate and can be used for:

Processes

Deposition Processes

• List of technologies for depositing this material and relevant process information specific to this material associated with this equipment/type of process.

Etching Processes

• Wet Etching
  • Pyrex etching can be done using Buffered HF or Hydrofluoric acid.
• RIE

Characterization Processes

• List of techniques for metrology/characterization can be used with this material and relevant process information specific to this material associated with this equipment/type of process.

Technical Data

• Charts or specific LNF related data for this material.

References

• Citations/references for this material, review articles. If possible, examples of users publications which includes the material.