RCA Bench 81
|RCA Bench 81|
|Material Processed||silicon, fused silica, glass|
|Sample Size||4" standard, some other sizes may be accommodated|
|Chemicals Used||Ammonium hydroxide, Hydrogen peroxide, Hydrofluoric acid, Hydrochloric acid|
|Supported Processes||RCA Clean|
RCA (Radio Corporation of America) Cleaning was developed for cleaning wafers prior to high temperature processing.
There is a tank for RCA-1, RCA-2, and dilute HF.
This wet bench is used for RCA cleaning samples which 1) do not need to go into the furnaces, or 2) have been been through the non-CMOS-clean processes of chemical mechanical polishing, Potassium Hydroxide/ KOH Etch, or AZ 400K developer, and which need to go back into furnaces.
RCA1/ Standard Clean 1/ SC1/ organic clean is a 5:1:1 mixture of water, ammonium hydroxide, and hydrogen peroxide. This etch is used to clean the organic particles from your wafers. This works by oxidizing the samples so that the particles will come off. After going through the organic clean, you will need to do a dilute HF dip to remove the oxides. See the SOP for details. The last step is to do RCA2/ Standard Clean 2/ SC2/ ionic clean is a 6:1:1 mixture of water, hydrochloric acid, and hydrogen peroxide. This clean is to remove the ionic contamination from the wafers.
- Hydrogen peroxide (H2O2) (30%, CMOS grade)
- Ammonium hydroxide (NH4OH) (29%, CMOS grade)
- Hydrochloric acid (HCl)(22-40%, CMOS grade)
- Hydrofluoric acid (HF) (49%, CMOS grade)
This bench contains a heated tank for RCA SC-1, a heated tank for RCA SC-2, and an unheated tank for dilute HF.
- Wafer Size: 4" standard, some other sizes may be accommodated
- Wafer type: silicon, fused silica, and glass allowed
|Warning:||You must use the buddy system for all chemical processing. No processing if you are alone in the lab. If the yellow warning lights are on it means that there are 2 or 1 people in the lab.|
Working with chemicals can be very dangerous. To minimize the chance of accident, make sure you always:
- Wear personal protective equipment.
- LNF Glove Policy
- Know the properties and hazards of chemicals you are working with. If you don’t know, find out by reading about them or asking staff.
- Plan the details of your process. Before you start working, plan what quantities of chemicals and sample carriers you will use. Plan how you will rinse your sample and what you will do with any waste generated. Make sure you know how the controllers work.
- Do not use this bench without proper training.
- There is one route of waste disposal from this bench: .
- Water aspirator: Only water, acids and bases can be disposed of using this aspirator. Do not aspirate solvents with this aspirator.
Silicon, fused silica, and glass substrates are allowed in the bench. Metals, compound semiconductors, photoresists, and polymers are not allowed.
The RCA Bench 81 is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email firstname.lastname@example.org for any material requests or questions.
Standard Operating Procedure
For a document version of the SOP, see here: Widget text will go here.
- Take the General Wet Bench Training, if you haven't already.
- Take Rise Online Training
- Read through this page and the Standard Operating Procedure above.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Take the RCA 81 Quiz
- Schedule a time using RCA Calendly
- Create a Helpdesk ticket to confirm your checkout