RIE KLA SPTS Synapse

RIE KLA SPTS Synapse
Equipment Details
Manufacturer	SPTS Technologies Ltd.
Model	SynapsEtch
Technology	RIE
Materials Restriction	Metals
Material Processed	GaN, Ga2O3, SiC, AlN
Mask Materials	Photoresist SiO2 Si3N4
Sample Size	150 mm
Gases Used	Ar, O2, H2, Cl2, BCl3, SF6
Equipment Manual
Overview	System overview
Operating Procedure	SOP
Supported Processes	Supported Processes
User Processes	User Processes

The SynapsEtch is an ICP RIE tool manufactured by SPTS Technologies. The system is designed to etch strongly bonded materials such as GaN, AlN, SiC, sapphire, and Ga₂O₃ through use of a high density plasma source.

System overview

Hardware details

• Gases
  • Ar
  • O₂
  • H₂
  • Cl₂
  • BCl₃
  • SF₆
• Pressure
  • 2350 L/sec Pfeiffer ATH2804MT Turbo Pump
  • 100 mTorr process gauge
  • Fast acting VAT pendulum valve
• Chuck
  • 150 mm Wafer
  • 0-20 Torr Backside He Cooling
  • -20°C to 55°C
• Chamber
  • Aluminum Walls, Heated 55°C
• RF
  • 3000 W, 13.56 Mhz Coil
  • 1500 W, 13.56 Mhz Platen

Substrate Requirements

• 150 mm wafers
  • 100 mm wafers and pieces can be mounted to a Si, SiO₂ or Si₃N₄ carrier wafer with the Sample mounting

Material restrictions

The SynapsEtch is designated as a Metals class tool. A full list of approved materials is included at the end of this section. In addition to the restrictions in this list, materials can be classified into four categories, detailed below: materials that may be etched, materials that can be used as masks, etch stop materials, and buried materials. Use of any material outside of these conditions requires approval by the LNF staff via a helpdesk ticket.

Materials etched

This tool is intended for etching GaN, AlN, SiC, sapphire, and Ga₂O₃ and other III-V's.

Mask materials

This includes any material that will be exposed to the plasma for the majority of the process. The most common mask material is photoresist. SiO₂ and Si₃N₄ can also be used. There are certain restrictions for where these materials may be deposited, as detailed in the approved materials list.

Etch stop materials

This includes any material that will be exposed briefly to the plasma. All materials listed in the approved materials list on the wiki are allowed, including approved mounting materials.

Buried materials

These materials may be present on the sample, but may not be exposed to the plasma. They may be covered by the mask or on the back of the sample, provided that the sample is mounted to a carrier wafer. Materials listed in the approved materials list on the wiki are allowed.

Approved materials

Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under the conditions described above. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

Processes can be found here LNF_User:RIE_KLA_SPTS_Synapse_user_processes

For more information, please contact the tool engineers via the helpdesk ticket system.

For all process questions, fill out the process request form and create a helpdesk ticket.

Standard operating procedure

SOP

Checkout procedure

1. Complete the sample mounting course. If you have already completed this for another tool, you do not need to complete it again.
2. Read through this page and the User Manual above.
3. Complete the process request form.
4. Schedule a time for a checkout:
   1. Find an available time for checkout here.
   2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
   3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
   4. Create a helpdesk ticket for final confirmation of your checkout appointment.
5. Schedule a time for a checkout using the above procedure.
6. Authorization will be provided pending successful demonstration of proper tool use in the presence of a tool engineer.