Changes

Jump to navigation Jump to search

Sputter deposition

2,259 bytes added, 6 years ago
**[[Titanium dioxide|Titanium dioxide(TiO2)]]
**[[Zinc|Zinc(Zn)]]
 
 
 
===Lab 18-1===
{{main|Lab 18-1}}
*Materials Deposited: [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]], [[Indium-Tin-Oxide|ITO]], [[Molybdenum|Mo]], [[Silicon|Si]], [[Silicon Dioxide|SiO<sub>2</sub>]], [[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Tantalum|Ta]], [[Tantalum|Ta<sub>2</sub>O<sub>5</sub>]], [[Titanium|Ti]], [[Titanium Dioxide|TiO<sub>2</sub>]]
*Lab 18-1 is a loadlocked magnetron sputter tool used for depositing metals, insulators, optical and semiconductive films. It has a variable-gated turbo pump and more sensitive gas flows that allow it to run more sensitive gas ratios (<1%) for reactive sputtering. It has a DC supply for conductive materials and RF supplies for electrically insulating materials. Deposition rates vary by material but are generally mich slower for RF depositions. The tool supports 5 materials at a time, rotated using the [https://docs.google.com/a/lnf.umich.edu/spreadsheet/ccc?key=0AsWeTTMTotIfdExOSHBhSVQ4dUpyRFFpWE5icEMwZlE#gid=23|Lab 18-1 Target Change Calendar]
 
===Lab 18-2===
{{main|Lab 18-2}}
*Materials: [[Aluminum|Al]],[[Chromium|Cr]],[[Copper|Cu]],[[Gold|Au]],[[Germanium|Ge]],[[Iridium|Ir]],[[Nickel|Ni]],[[Nickel-Chromium|NiCr]],[[Platinum|Pt]],[[Silicon|Si]],[[Silver|Ag]],[[Titanium|Ti]]
*Lab 18-2 is a loadlocked magnetron sputter tool used for mostly for depositing metals. It uses DC for conductive materials and RF for electrically insulating materials. Deposition rates vary by material but are generally slower for RF depositions. The tool supports 5 materials at a time, rotated using the [https://docs.google.com/a/lnf.umich.edu/spreadsheet/ccc?key=0AsWeTTMTotIfdGxLMlpVZm1NSlF0SDJMU3hvRFctR1E#gid=13|Lab 18-2 Target Change Calendar]
 
===Denton Explorer===
{{main|Denton Explorer}}
*The Denton Explorer is an open-loop 2-source magnetron sputter tool used as a Lab 18 backup for depositing metal films
 
===AMS 2004 Aluminum Nitride Sputter Tool===
{{main|AMS 2004 Aluminum Nitride Sputter Tool}}
*Materials deposited: AlN, Al
*The AMS tool is designed specifically for Piezoelectric AlN on 4" wafers. It is a high temperature process that works only on certain substrates with specific seeding matetrials and the handler is only designed for 4" wafers are this time.
==References==
*[[Wikipedia:Sputter_deposition|General Overview: Wikipedia Sputter Deposition]]
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser
904

edits

Navigation menu