Changes

Jump to navigation Jump to search

Substrate bonding

14 bytes added, 6 years ago
Low production costs
===Technology 6Metallic Diffusion bonding===
{{main|Metallic diffusion bonding}}
Metal diffusion bonding is based on Cu-Cu, Al-Al, Au-Au and other metallic bonds. In addition, the use of metal diffusion allows two wafers to be bonded both mechanically and electrically in a single step. The technique is required for bonding in 3D applications such as 3D stacking.
Staff
172

edits

Navigation menu