Changes

Jump to navigation Jump to search

YES-CV200RFS(E)

138 bytes added, 6 years ago
no edit summary
}}
The YES-CV200RFS(E) is a single wafer, downstream [[Plasma etching|plasma strip/descum]] tool designed by Yield Engineering Systems. It is designed for fast plasma stripping of [[photoresist]]s and other organic materials at up to 7000 Å/min. It can also be used for [[surface modification]] and gentle surface cleaning. It supports pieces and wafers from 2” to 8” and wafer pieces. The tool mainly uses [[oxygen]] plasma for organics removal, but it has been configured with three additional process gases ([[Ar]], [[Nitrogen|N<sub>2</sub>]], and [[Nitrogen trifluoride|NF<sub>3</sub>]]), for additional stripping and surface modification techniques.
{{note|The [[Plasmatherm 790]] has a descum recipe comparable to the YES that can be used until the YES is brought back online.|reminder}}
==Announcements==
No announcements at this time
OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Bureaucrats, Interface administrators, Administrators, Widget editors
2,126

edits

Navigation menu