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Sputter deposition

14 bytes added, 7 years ago
** [[Lab 18-1|Lab 18-1]]
** [[Lab 18-2|Lab 18-2]]
** [[Lab 18-2PVD 75 Proline|PVD 75]]
===AMS 2004 Aluminum Nitride Sputter Tool===
===PVD 75 Magentron Sputter Tool===
{{main|PVD 75Proline}}
*Materials deposited: [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]],[[Aluminum|Al]],[[Chromium|Cr]],[[Copper|Cu]], [[Indium-Tin-Oxide|ITO]], [[Molybdenum|Mo]], [[Silicon|Si]], [[Silicon Dioxide|SiO<sub>2</sub>]], [[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Tantalum|Ta]], [[Tantalum|Ta<sub>2</sub>O<sub>5</sub>]], [[Titanium|Ti]], [[Titanium Dioxide|TiO<sub>2</sub>]],[[Nickel|Ni]],[[Silver|Ag]],[[Titanium|Ti]]
*The PVD 75 tool is designed specifically for point of use processing. Qualified users can change targets when they vent the chamber to load their samples.
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