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PVD 75 Proline

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{{infobox equipment
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
|materials = [[Aluminum|Al]], [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]],[[Chromium|Cr]], [[Copper|Cu]],[[GoldCobalt|AuCo]],[[GermaniumIron|GeFe]],[[IridiumNickel|IrNi]],[[NickelMolybdenum|NiMo]],[[Nickel-ChromiumSilicon|NiCrSi]],[[PlatinumSilicon Dioxide|PtSiO<sub>2</sub>]],[[SiliconNitride|Si<sub>3</sub>N<sub>4</sub>]],[[Silver|Ag]],[[Titanium|Ti]],[[Tungsten|W]]
|mask =
|size = 150mm x 4mm and smaller samples
}}
<!-- Insert the tool description here -->
The PVD 75 Proline is a magnetron [[sputter deposition]] tool for depositing conductive metallic and non conductive dielectric films. The PVD 75 tool is designed specifically for '''point of use processing of materials not allowed or not currently in the Lab 18 tools.''' Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features.
==Announcements==
<!-- *Update this with announcements as necessary -->
 *The target change process on this tool is a user supported process[https://docs. That can be completed during the tool reservation when the chamber is vented to load samplesgoogle.com/spreadsheets/d/1yMY0SG8PDlF4UWxz96uJVnmP9mcxYr0wGc1xmzmgF48/edit#gid=1886308597| LNF Sputter Calendar]
==Capabilities==
* Computer controlled recipes
* Non load lock configuration
* limited film stress versatility with in film development.
* Reactive film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
==System Overview==*Computer controlled recipesThe PVD 75 has a 14" square-shaped chamber high vacuum process chamber*Non load lock configuration*limited film stress versatility with in film development. The tools four Tourus Mag Kepper magnetron sputtering sources are set up to allow for RF*Reactive film capabilities (Ar, DCO<sub>2</sub>, Pulse DC and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 350°C is achieved by using the tools quartz heater lamps.N<sub>2</sub>)
===Hardware Details=Supported Processes==*Cryo pumped chamber – upper 10<sup>-7<[[{{BASEPAGENAME}}/sup> Torr base pressure*Chamber capacity: single wafer*Configured with port for future load lock*Sample heating – up to 350°C**Four 3” Sputtering Guns**2 DC (one pulse DC source) and 2 RF power supply (one for sample RF bias)Processes]]
===Substrate Requirements===*Sample sizes: pieces, up to 6” wafers.*Wafer holders available for 2Basic ", 3User"access with the Lab 18's provide researchers the ability to load, 4"transfer samples, 6"; as well as clip fixtures for smaller pieces** Diameter 150 mm maximum** Substrates up to 4 mm Thickand deposit standard characterized materials. With special fixture up to 8 mm.** For more details, see [[https:{{BASEPAGENAME}}//docs.googleProcesses]].com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
===Material Restrictions==={{material restrictions}} ==Supported Processes== Basic "User" access with the Lab 18's provide researchers the ability In addition to loadthese, transfer samples, and deposit standard characterized this tool has a number of user-supported recipes for depositing a wide variety of materials. For more details, see [[{{BASEPAGENAME}}/Some of these recipes are documented on User Processes]].
In addition If you have a material deposition need that is not listed, check to these, see if this material is deposited on another PVD tool has a number of user-supported recipes or see more about options for depositing a wide variety of materials. Some of these recipes are documented running your own private material on the [[LNF_User:Lab_18-2_User_ProcessesLNF PVD Films|User ProcessesLNF PVD Films]]page. If you are curious if your material can be deposited in this tool, please contact The PVD 75 Proline is the preferred sputtering tool engineers via for non-standard materials. See how to [http://lnf-wiki.eecs.umich.edu/wiki/LNF_PVD_Films#Requesting_to_Add_New_PVD_Materials Request New PVD Films] here. See more on how to request new sputter sources specifically on the helpdesk ticket system[https://lnf-wiki.eecs.umich.edu/wiki/LNF_Sputter_Adding_New_Films LNF Sputter Adding New Films] page.
===Process Name===
{| class="wikitable" border="1"
|-
! Material! Max thickness (Run/Reservation)!
|-
| Aluminum ([[Aluminum|Al]])| 3000Å / 1 µm / NA
|-
| Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])| 1000Å 500Å / NA3000Å
|-
| Chrome Chromium ([[ChromeChromium|Cr]])| 2000Å 3000Å / NA9000Å
|-
<!--| Copper ([[Copper|Cu]])
| 1000Å / 5000Å
|--->
<!--| Germanium ([[Germanium|Ge]])
| 4000 Å / NA
| 5000Å / NA
|--->
|Iron ([[Iron|Fe]])
|2000Å / 6000Å
|-
| Iron Nickel ([[IronNickel|IrNi]])| 1000Å 2000 Å / 5000Å 6000Å
|-
| Nickel ([[Nickel|Ni]])| 5000 Å / 1 µm |-<!--| Molybdenum ([[Molybdenum|Mo]])| 2000 3000 Å / 8000 Å
|--->
<!--| Platinum ([[Platinum|Pt]])
| 5000 Å / 1 µm
|--->
|Silver ([[Silver|Ag]])
|3000 Å / 6000Å
|-
|Silicon ([[Silicon|Si]])
|3000 Å / 6000Å
|-
|Silicon Dioxide ([[Silicon Dioxide|SiO<sub>2</sub>]])
|1000 Å / 3000Å
|-
| Silver Silicon Nitride ([[SilverSilicon Nitride|AgSi<sub>3</sub>N<sub>4</sub>]])| 5000 500 Å / 1 µm1000Å
|-
<!--| Silicon ([[Silicon|Si]])
| 5000 Å / 1 µm
|--->
<!--| Silicon Dioxide ([[Silicon Dioxide|SiO<sub>2</sub>]])
| 5000 Å / 1 µm
|--->
<!--| Tantalum ([[Tantalum|Ta]])
| 2000 Å / NA
|--->
| Titanium ([[Titanium|Ti]])| 2000 3000 Å / 5000 6000 Å
|-
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
| 2000 Å / 5000 Å
|--->
| Tungsten ([[Tungsten|W]])| 3000 Å / 9000 Å
|-
<!--| Tungsten/Titanium ([[Tungsten/Titanium|W-Ti]])
| 3000 Å / 8000 Å
|--->
|}
 
==System Overview==
The PVD 75 has a 14" square-shaped chamber high vacuum process chamber. The tools four Tourus Mag Kepper magnetron sputtering sources are set up to allow for RF, DC, Pulse DC and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 350°C is achieved by using the tools quartz heater lamps. The average run time on this tool per wafer is about two hours.
 
===Hardware Details===
 
*Cryo pumped chamber – lower 10<sup>-6</sup> Torr base pressure
*Chamber capacity: single wafer
*Configured with port for future load lock
*Sample heating – up to 350°C
**Four 3” Sputtering Guns
**2 DC (one pulse DC source) and 2 RF power supply (one for sample RF bias)
 
===Substrate Requirements===
 
*Sample sizes: pieces, up to 6” wafers.
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
**Diameter 150 mm maximum
**Substrates up to 4 mm Thick. With special fixture up to 8 mm.
**[https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
 
===Material Restrictions===
{{material restrictions}}
==Standard Operating Procedure==
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=1WXj9Ykp4t0WAS3hdYazaYHId4eNTV7hPJ0_bKtfasjE1vf2enLWa1qMT0sAis9bUFoyuTnNjLszRxbj0Rkh4trw}}
==Checkout Procedure==
The PVD 75 is on the [[LNF Scheduler]]. LNF constituents may reserve time on the tool, and even request staff support for process development.<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->For more details, see [[Lab 18 access KJLC Sputter Tool Access and trainingTraining]].# Complete the following items#*Read the Standard Operating Procedure above#*online [https://docsrise.googlearticulate.com/presentation/dshare/1nO94aGlw5j6rmivVmYAo7oMeRC8efjEeqElzqlBiPE6uyJ9y-nPCghMDGjSD-8RN413huMWmIT#/edit?usp=sharing| PVD 75 Tool VerificationRise Training](this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)#*[https://docs.googleRead through this Wiki page and the Operating Procedure above.com/forms/d/e/1FAIpQLSejdgAcE9d7_fgmUWHDxykaoB4GpflVnP9anXV2gMXnoUscGw/viewform?embedded=true#start=embed| PVD 75 User Training Quiz]<!--==#*<iframe src="httpsCreate a [http://docsssel-sched.eecs.googleumich.comedu/presentationsselScheduler/d/1nO94aGlw5j6rmivVmY-nPCghMDGjSD-8RN413huMWmI/embedResourceContact.aspx?starttabindex=true3&looppath=false&delayms=3000" frameborder="0" width="480" height="299" allowfullscreen="true" mozallowfullscreen="true" webkitallowfullscreen="true"></iframe>==--><!--:0:0:{{# Complete the training request form [<link> herevar:toolid}} Helpdesk Ticket]. --># Create a helpdesk ticket requesting training. # A tool engineer or user services member will schedule contact you for a time for initial trainingsession.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
<!--# Complete the SOP quiz [<link> herehttps://docs.google.com/forms/d/e/1FAIpQLSejdgAcE9d7_fgmUWHDxykaoB4GpflVnP9anXV2gMXnoUscGw/viewform?embedded=true#start=embed| PVD 75 User Training Quiz]. --># Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the toolat the "user" level<!--==Tool Qualification== --><!-- Describe standard maintenance/qualification tests here -->
==Maintenance==
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreUser
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