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Plasmatherm 790

261 bytes removed, 9 months ago
[[H2|H<sub>2</sub>]], [[Oxygen|O<sub>2</sub>]], [[SF6|SF<sub>6</sub>]]
|overview = [[{{PAGENAME}}#System_Overview | System Overview]]
|sop = [ [{{PAGENAME}}#Standard_Operating_Procedure | SOP]|maintenance = [ Maintenance Overview]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:Plasmatherm_790_User_Processes|User Processes]] }}
The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for [[Reactive ion etching|reactive ion etching (RIE)]] while the right chamber is configured for [[PECVD|plasma enhanced chemical vapor deposition (PECVD)]]. The RIE chamber is significantly slower than other etchers available in the lab, allowing greater depth control on thin films. The PECVD chamber is also designed to deposit at a lower rate than the [[GSI PECVD]] and [[P5000 PECVD]] - the smaller building blocks help improve film quality. This tool has almost no material restrictions, allowing a wide variety of processing.
*[2014-09-25] - Added 500 sccm Helium MFC to PECVD chamber.
* RIE Gases
** [[Argon|Ar]] - 139 sccm
** [[Methane|CH<sub>4</sub>]] - 18 14 sccm
** [[Fluoroform|CHF<sub>3</sub>]] - 50 sccm
** [[Tetrafluoromethane|CF<sub>4</sub>]] - 42 sccm
* PECVD Gases
** [[Methane|CH<sub>4</sub>]] - 72 sccm
** [[Tetrafluoromethane|CF<sub>4</sub>- 4% O<sub>2</sub>]] - 420 sccm
** [[Helium|He]] - 500 sccm
** [[Nitrogen|N<sub>2</sub>]] - 2000 sccm
* Pressure
** RIE: 5 - 10 mTorr to 1 TorrGuage** PECVD: 50 - 500 mTorr to 2 TorrGauge
* Chuck
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
The latest PECVD qualification data is shown below.
==Standard Operating Procedure==
* [ System Overview]* [ Plasmatherm 790 ?usp=sharing&resourcekey=0-ClQBXI80fBwIL1FR48tt7w RIE SOP]* [ PECVD SOP]* [ Troubleshooting]
==Checkout Procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through the Standard Operating Procedure User Manual above.# Complete Accurately complete the training request form [ hereSOP quiz]. You may retake as necessary until all answers are correct.# For RIE, complete the [ process request form].# Create a [{{#var:toolid}} helpdeskticket] ticket requesting traininga checkout session.# A tool engineer Authorization will schedule a time for initial training.# Practice with your mentor or another authorized user until you are comfortable with tool operation.# Complete be provided pending successful completion of the SOP quiz [ here].# Schedule a checkout session with a and demonstration of proper tool engineer via use in the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool. ==Maintenance== Every other week presence of a light cleaning is performed on the toolengineer. A 5 min etch with [[Plasmatherm_790/Processes/m_si_o_1|m_si_o_1]] is performed on a 4" oxide wafer as a qualification run. The results can be seen below. {{#widget:Iframe|url=;format=interactive |width=700|height=350|border=0}}
OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Administrators


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