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Plasmatherm 790

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<!-- Set the resource ID, 5 digit # found on the scheduler -->
<!-- Set the Process Technology (see subcategories on Equipment page) -->
{{#vardefine:toolid|#####10030}}{{#vardefine:technology|Process TechnologyRIE}}{{resource}}
{{infobox equipment|restriction = [[{{PAGENAME}}#Material_Restrictions|Metals]]|materials = [[Si]], [[SiO2|SiO<sub>2</sub>]]|mask = [[Photoresist|PR]], [[SiO2|SiO<sub>2<!-- /sub>]]|gases = [[FileAR]], [[CH4|CH<sub>4</sub>]], [[CHF3|CHF<sub>3</sub>]], [[CF4|CF<sub>4</sub>]], [[H2|H<sub>2</sub>]], [[O2|O<sub>2</sub>]], [[SF6|SF<sub>6</sub>]]|overview = [[{{PAGENAME}}#System_Overview | System Overview]]|sop = [https:LAM_9400//docs.google.com/a/lnf.umich.jpgedu/document/d/1iRHIBHG0BvqpsX1quhb8YszCImOkyvzJx_SxqluPOt8/preview SOP]|processes = [[{{PAGENAME}}/Processes|Supported Processes]]|rightuserprocesses = [[LNF_User:Plasmathem_790_User_Processes|500pxUser Processes]] -->}} {{warning|This page has not been released yet.}}
<!-- Insert the tool description here -->
The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for reactive ion etching (RIE) while the right chamber is configured for plasma enhanced chemical vapor deposition (PECVD).
==Announcements==
*Update this with announcements as necessary
 
==Capabilities==
<!--A more general description of what the tool is capable of doing.-->
* Etch Rate
* Resolution
* Aspect Ratio
* Thickness range
 
==System Overview==
===Hardware Details===* RIE Gases** [[AR]] - 139 sccm** [[CH4|CH<sub>4<!/sub>]] -18 sccm** [[CHF3|CHF<sub>3</sub>]] - To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". 50 sccm** [[CF4|CF<sub>4</sub>]] -42 sccm** [[H2|H<sub>2</sub>]] -101 sccm** [[O2|O<sub>2</sub>]] - 100 sccm{{EquipmentManual** [[SF6|googledocid}}SF<sub>6</sub>]] - 52 sccm* PECVD Gases** [[AR]]** [[He]]
===Tool Capabilities/Limitations===* Hardware DetailsPressure** Power specsChuck** ChemicalsChamber** Gases * Capabilities** Resolution** Aspect Ratio** Thickness rangeRF / Power Specs
===Substrate Requirements===
* Sample size rangeRIE** DiameterUp to 3 100 mm (4") wafers** ThicknessPieces don't require mounting*PECVD** 1 150 mm (6") wafer** 2 100 mm (4") wafers** Several pieces
===Material Restrictions===
==Supported Processes==
<!-- We recommend creating a subpage detailing the supported processes for the tool, which can be created using the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document should be included here, using {{EquipmentManual|googledocid}} as above -->
 
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
==Standard Operating Procedure==
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{EquipmentManual#widget:GoogleDoc|googledocidkey=1iRHIBHG0BvqpsX1quhb8YszCImOkyvzJx_SxqluPOt8}}
==Checkout Procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through this page and the Standard Operating Procedure above.
# Complete the training request form [<link> here].
# Create a helpdesk ticket [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
# A tool engineer will schedule a time for initial training.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
==Tool Qualification==
<!-- Describe standard maintenance/qualification tests here -->Every other week a light cleaning is performed on the tool. A 5 min etch with mnf_oxide1 is performed on a 4" oxide wafer. The results can be seen below.
===Process Name===
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
{{#widget:Iframe
|url=https://docs.google.com/a/lnf.umich.edu/spreadsheets/d/1xPqe1kOhQc2QN4guhB4_VqQd8fRzWsUz4W4InGM6l3E/gviz1jDSV00jZ-1vppt2MgGRAJyXRvxEE3rJIlXtngODM9-0/chartiframepubchart?oid=5229847821969686906&format=interactive
|width=800
|height=400
|border=0
}}
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