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Lab 18-2

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<!-- Set the resource ID, 5 digit # found on the scheduler --> <!-- Set the Process Technology (see subcategories on Equipment page) -->
[[Sputter_deposition|< Sputter deposition]]
<!-- Set the resource ID, 5 digit # found on the scheduler --> {{#vardefine:toolid|61081}} <!-- Set the Process Technology (see subcategories on Equipment page) -->{{#vardefine:technology|PVD}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals -->{{#vardefine:restriction|3}}
{{infobox equipment
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
|mask =
|size = 150mm x 4mm and smaller samples
|gases = [[Ar]], [[N2|N<sub>2</sub>]], [[O2|O<sub>2</sub>]]
|overview = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1UZYJ8unAjQOIJ3nJpa1fwXxYKMyW12k6eDR-A-P6fIE/preview System Overview]-->
|sop = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1EPC0U7RQCQLbFe4fL90aMUlLz-fydskqWrUs4hVPpbM/preview SOP]-->
|processes = [[{{PAGENAME}}/Lab 18-2#Supported Processes|Supported Processes]]|userprocesses = [[LNF_User:Lab_18-1_User_Processes|User Processes]]
}}
 
<!-- Insert the tool description here -->
Lab 18-2 is a magnetron [[Sputter_deposition|sputter deposition]] tool used for depositing conductive metallic the application of very thin films; 10-2000nm. Sputter deposition This tool is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported set up to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, Wdeposit metals including; Au, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxidePt, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact Cr and insulating layers over featuresW among others.
==Announcements==
<!-- *Update this with announcements as necessary -->
*The target configuration has been moved to the Supported Process section belowMaterials are changed every Monday {{#widget:Iframe|url=https://docs.google. Follow the link to Lab 18com/spreadsheets/d/e/2PACX-21vRlmI6w0KI2KXYHH8xyUxhCIDwpUBR0qohNJR61GuVr64OLT9rNYjGCAQ0o9XEGKd2QPwqdJ6uVdsB4/Processespubhtml?gid=1242670380&amp;single=true&amp;widget=true&amp;headers=false|width=900|height=500|border=0}} [https://docs.google. On that page under the Target com/spreadsheets/d/1yMY0SG8PDlF4UWxz96uJVnmP9mcxYr0wGc1xmzmgF48/edit#gid=1242670380| Calendar header is the link to the calendar.Link]*Need a different metal? Request it with Helpdesk!
==Capabilities==
* Computer controlled recipes
* Load lock supported processing
* limited Limited film stress versatility with in film development.* Reactive Film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
==System OverviewSupported Processes==The Lab 18-2 has a 18" D-shaped chamber with a load lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 500C is achieved by using the tools quartz heater lamps.*[[{{BASEPAGENAME}}/Processes]]
===Hardware Details===*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure*Chamber capacity: single wafer*Configured Basic "User" access with the Lab 18's provide researchers with a the ability to load lock*Sample heating – up to 500°C* Power specs**Five 3” Sputtering Guns**2 DC , transfer samples, and deposit standard characterized materials. For more details such as standard recipe parameters and 2 RF power supply sidewall coverage (one for sample biaslimited data), see [[{{BASEPAGENAME}}/Processes]].
===Substrate Requirements===*Sample sizes: pieces, up In addition to 6” wafers.*Wafer holders available for 2"these, 3", 4", 6"; as well as clip fixtures this tool has a number of user-supported recipes for smaller pieces** Diameter 150 mm maximum** Substrates up to 4 mm Thick. With special fixture up to 8 mm.** [https://docsdepositing a wide variety of materials.googleSome of these recipes are documented on User Processes.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
===Material Restrictions==={{If you have a material deposition need that is not listed, check to see if this material restrictions}} ==Supported Processes== Basic "User" access with is deposited on on another PVD tool on the Lab 18's provide researchers with the ability to load[[LNF PVD Films|LNF PVD Films]] page, transfer samples, and deposit standard characterized materials. For or see more details, see options for running your own private material on the [[{{BASEPAGENAME}}/Processes#Target_Calendar|Target configuration]]section of the {{BASEPAGENAME}}/Processes pageIn addition to these, this The PVD 75 Proline is the preferred sputtering tool has a number of userfor non-supported recipes for depositing a wide variety of standard materials. Some of these recipes are documented on User ProcessesSee how to [http://lnf-wiki.eecs.umich. Wondering if your material can be deposited in this tool, please contact the tool engineers via the helpdesk ticket systemedu/wiki/LNF_PVD_Films#Requesting_to_Add_New_PVD_Materials Request New PVD Films] here. See more about privately supported materials on how to request new sputter sources specifically on the [[https://lnf-wiki.eecs.umich.edu/wiki/LNF_Sputter_Adding_New_Films|LNF Sputtering Sputter Adding New Films]] page.
===Process Name===
|-
| Aluminum ([[Aluminum|Al]])
| 5000Å / NA1 µm
|-
<!--| Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])
| 1000Å / NA
|-->
| Chrome Chromium ([[ChromeChromium|Cr]])
| 2000Å / NA
|-
<!--| Copper ([[Copper|Cu]])
| 1000Å / 5000Å
|--->
<!--| Germanium ([[Germanium|Ge]])
| 4000 Å / NA
|--->
| Gold ([[Gold|Au]])
| 3000Å / 5000Å / NA
|-
<!--| Iron ([[Iron|Ir]])
| 1000Å / 5000Å
|--->
| Nickel ([[Nickel|Ni]])
| 5000 2000 Å / 1 µm 5000Å
|-
<!--| Molybdenum ([[Molybdenum|Mo]])
|--->
| Platinum ([[Platinum|Pt]])
| 5000 1000 Å / 1 µm|-| Silver ([[Silver|Ag]])| 5000 Å / 1 µm5000Å
|-
<!--| Silver ([[Silver|Ag]])
| 2000 Å / 5000Å
|--->
<!--| Silicon ([[Silicon|Si]])
| 5000 Å / 1 µm
|--->
| Titanium ([[Titanium|Ti]])
| 2000 3000 Å / 5000 Å
|-
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
|-
| Tungsten/Titanium ([[Tungsten/Titanium|W-Ti]])
| 3000 Å / 8000 9000 Å
|-
|}
==Standard Operating ProcedureSystem Overview==<!The Lab 18-2 has a 18" D- To include shaped chamber with a document from google docsload lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, use and DC co-sputtering. There is an additional Rf power supply on the line belowsubstrate platen to allow for in situ sample cleans, replace "googledocid" with and bias voltage to manipulate the ID for film characteristics. Sample heating up to 500C is achieved by using the documenttools quartz heater lamps. Remember ===Hardware Details===*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure*Chamber capacity: single wafer*Configured with a load lock*Sample heating – up to 500°C* Power specs**Five 3” Sputtering Guns**2 DC and 2 RF power supply (one for sample bias) ===Substrate Requirements===*Sample sizes: pieces, up to make this visible6” wafers.*Wafer holders available for 2", 3", 4", you must set Sharing 6"; as well as clip fixtures for the smaller pieces** Diameter 150 mm maximum** Substrates up to 4 mm Thick. With special fixture up to 8 mm.** [https://docs.google.com/document to "Anyone with /d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting] ===Material Restrictions===The Lab 18-2 is the link can view"sole sputtering tool for precious metal materials. -->{{material restrictions}} == Detailed Operating Procedure =={{#widget:GoogleDoc|key=1tXD5ABUT7U9eY8iZhgvfND5XGPfkHmby6O6Tp1R_uj2oR6XJHc4D-J8opSyOfX-9bU1AXjf9-9ZVN3Jsln4c_o}}<br>
==Checkout Procedure==
The Lab 18-2 is on the [[LNF Scheduler]]. LNF constituents may reserve time on the tool, and even request staff support for process development.<!-- This is an example of a chart published with etch data. You can just replace the url with your own. -->For more details, LNF researchers can see [[Lab 18 access KJLC Sputter Tool Access and trainingTraining]] for .# Complete the different access typesonline [https://rise.articulate.com/share/Ao7oMeRC8efjEeqElzqlBiPE6uyJ9y-T#/ PVD Rise Training] (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)# Read through this Wiki page and the Standard Operating Procedure above.<!--# Complete the training request form Create a [<link> here]http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact. -->aspx?tabindex=3&path=0:0:0:{{# Create a helpdesk ticket var:toolid}} Helpdesk Ticket] requesting training. # A tool engineer or user services member will schedule contact you for a time for initial trainingsession.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
<!--# Complete the SOP quiz [<link> here]https://docs.google. com/forms/d/e/1FAIpQLSevGEsCoP5aNyADbDpt3_7tflfn_1mZNA-->EM2lOOA0doqYbyw/viewform?embedded=true#start=embed| Lab 18 User Training Quiz]# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the toolat the "user" level.
<!--==Tool QualificationMaintenance== The sputter shield cleaning procedure is provided below. The source shields are stored on the rack between the Lab 18s when they are not installed. Some films that build up on the shield risk flaking off and shorting out plasma (W-->Ti and ITO are the most frequent offenders). This procedure mitigates that, so it is posted here to empower users. <!-- Describe standard maintenance[https://docs.google.com/document/d/1TZFJKKvrBdjAQzsVgegt7mPrAVCy0OPCNOY276lf9vc/qualification tests here -->edit?usp=sharing| Lab 18 Shield Cleaning Procedure]
==Maintenance==
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreUser
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