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Plasmatherm 790

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<!-- Set the resource ID, 5 digit # found on the scheduler -->
<!-- Set the Process Technology (see subcategories on Equipment page) -->
{{#vardefine:toolid|10030}} {{#vardefine:technology|RIE}} {{resource}} [[Category:PECVD]]
{{infobox equipment
|restriction = [[{{PAGENAME}}#Material_Restrictions|Metals]]
{{warning|This page has not been released yet.}}
<!-- Insert the tool description here -->
The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for reactive ion etching (RIE) while the right chamber is configured for plasma enhanced chemical vapor deposition (PECVD).
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