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{{warning|This page has not been released yet.}} The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for reactive ion etching (RIE) while the right chamber is configured for plasma enhanced chemical vapor deposition (PECVD). {{#vardefine:toolid|10030}} {{#vardefine:technology|RIE}} {{resource}} [[Category:PECVD]]{{infobox equipment
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|restriction = [[{{PAGENAME}}#Material_Restrictions|Metals]]
|materials = [[Si]], [[SiO2|SiO<sub>2</sub>]]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:Plasmathem_790_User_Processes|User Processes]]
}} {{warning|This page has not been released yet.}} The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for reactive ion etching (RIE) while the right chamber is configured for plasma enhanced chemical vapor deposition (PECVD).
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