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|sop = [https://docs.google.com/a/lnf.umich.edu/document/d/1iRHIBHG0BvqpsX1quhb8YszCImOkyvzJx_SxqluPOt8/preview SOP]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:Plasmathem_790_User_Processes|User Processes]]}} {{warning|This page has not been released yet.}}The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for reactive ion etching (RIE) while the right chamber is configured for plasma enhanced chemical vapor deposition (PECVD).
