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YES-CV200RFS(E)

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|manufacturer = [http://www.yieldengineering.com/ Yield Engineering Systems]
|model = CV200RFS(E)
}} The [[{{PAGENAME}}]] is a single wafer, downstream [[Plasma etching#Plasma_ashing|plasma strip/descum]] tool designed by [http://www.yieldengineering.com/ Yield Engineering Systems]. It is designed for fast plasma stripping of [[photoresist]]s and other organic materials at up to 7000 Å/min. It can also be used for [[surface modification]] and gentle surface cleaning. It supports pieces and wafers from 2” to 8” and wafer pieces. The tool mainly uses [[oxygen]] plasma for organics removal, but it has been configured with three additional process gases ([[Ar]], [[Nitrogen|N<sub>2</sub>]], and [[Nitrogen trifluoride|NF<sub>3</sub>]]), for additional stripping and surface modification techniques.
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