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Sputter deposition

18 bytes added, 4 years ago
{{main|Lab 18-1}}
*Materials Deposited: [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]], [[Indium-Tin-Oxide|ITO]], [[Molybdenum|Mo]], [[Silicon|Si]], [[Silicon Dioxide|SiO<sub>2</sub>]], [[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Tantalum|Ta]], [[Tantalum|Ta<sub>2</sub>O<sub>5</sub>]], [[Titanium|Ti]], [[Titanium Dioxide|TiO<sub>2</sub>]]
*Lab 18-1 is a loadlocked magnetron sputter tool used for depositing '''less common metals, insulators, optical and semiconductive films. ''' It has a variable-gated turbo pump and more sensitive gas flows that allow it to run more sensitive gas ratios (<1%) for reactive sputtering. It has a DC supply for conductive materials and RF supplies for electrically insulating materials. Deposition rates vary by material but are generally much slower for RF depositions. The tool supports 5 materials at a time, rotated using the [|Lab 18-1 Target Change Calendar]
===Lab 18-2===
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser


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