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PVD 75 Proline

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The PVD 75 Proline is a magnetron [[sputter deposition]] tool for depositing conductive metallic and non conductive dielectric films. The PVD 75 tool is designed specifically for '''point of use processing of materials not allowed or not currently in the Lab 18 tools.''' Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features.
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