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Lab 18-2

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|mask =
|size = 150mm x 4mm and smaller samples
|gases = [[Ar]], [[N2|N<sub>2</sub>]], [[O2|O<sub>2</sub>]]
|overview = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1UZYJ8unAjQOIJ3nJpa1fwXxYKMyW12k6eDR-A-P6fIE/preview System Overview]-->
|sop = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1EPC0U7RQCQLbFe4fL90aMUlLz-fydskqWrUs4hVPpbM/preview SOP]-->
|processes = [[{{PAGENAME}}/Lab 18-2#Supported Processes|Supported Processes]]|userprocesses = [[LNF_User:Lab_18-2_User_Processes|User Processes]]
}}
<!-- Insert the tool description here -->
Lab 18-2 is a magnetron [[Sputter_deposition|sputter deposition]] tool used for '''depositing''' '''common and precious metalsthe application of very thin films; 10-2000nm.''' Sputter deposition This tool is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported set up to the surface of the substratedeposit metals including; Au, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxidePt, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact Cr and insulating layers over featuresW among others.
==Announcements==
<!-- *Update this with announcements as necessary -->
*The target configuration has been moved to the Supported Process section belowMaterials are changed every Monday {{#widget:Iframe|url=https://docs.google. Follow the link to Lab 18com/spreadsheets/d/e/2PACX-21vRlmI6w0KI2KXYHH8xyUxhCIDwpUBR0qohNJR61GuVr64OLT9rNYjGCAQ0o9XEGKd2QPwqdJ6uVdsB4/Processespubhtml?gid=1242670380&amp;single=true&amp;widget=true&amp;headers=false|width=900|height=500|border=0}} [https://docs.google. On that page under the Target com/spreadsheets/d/1yMY0SG8PDlF4UWxz96uJVnmP9mcxYr0wGc1xmzmgF48/edit#gid=1242670380| Calendar header is the link to the calendar.Link]*Need a different metal? Request it with Helpdesk!
==Capabilities==
* Computer controlled recipes
* Load lock supported processing
* limited Limited film stress versatility with in film development.* Reactive Film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
==System OverviewSupported Processes==The Lab 18-2 has a 18" D-shaped chamber with a load lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 500C is achieved by using the tools quartz heater lamps.*[[{{BASEPAGENAME}}/Processes]]
===Hardware Details===
*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure
*Chamber capacity: single wafer
*Configured with a load lock
*Sample heating – up to 500°C
* Power specs
**Five 3” Sputtering Guns
**2 DC and 2 RF power supply (one for sample bias)
 
===Substrate Requirements===
*Sample sizes: pieces, up to 6” wafers.
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
** Diameter 150 mm maximum
** Substrates up to 4 mm Thick. With special fixture up to 8 mm.
** [https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
 
===Material Restrictions===
The Lab 18-2 is the sole sputtering tool for precious metal materials.
{{material restrictions}}
 
==Supported Processes==
Basic "User" access with the Lab 18's provide researchers with the ability to load, transfer samples, and deposit standard characterized materials. For more details such as standard recipe parameters and sidewall coverage (limited data), see [[{{BASEPAGENAME}}/Processes]].
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes.
If you have a material deposition need that is not listed, check to see if this material is deposited on on another PVD tool on the [[LNF PVD Films|LNF PVD Films]] page, or see more about options for running your own private material on the [[LNF {{BASEPAGENAME}}/Processes#Target_Calendar|Target configuration]] section of the {{BASEPAGENAME}}/Processes page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to [http://lnf-wiki.eecs.umich.edu/wiki/LNF_PVD_Films#Requesting_to_Add_New_PVD_Materials Request New PVD Films|] here. See more on how to request new sputter sources specifically on the [https://lnf-wiki.eecs.umich.edu/wiki/LNF_Sputter_Adding_New_Films LNF PVD Sputter Adding New Films]] page.
===Process Name===
| 1000Å / NA
|-->
| Chrome Chromium ([[ChromeChromium|Cr]])
| 2000Å / NA
|-
|}
==Standard Operating ProcedureSystem Overview==<!The Lab 18-2 has a 18" D- To include shaped chamber with a document from google docsload lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, use and DC co-sputtering. There is an additional Rf power supply on the line belowsubstrate platen to allow for in situ sample cleans, replace "googledocid" with and bias voltage to manipulate the ID for film characteristics. Sample heating up to 500C is achieved by using the documenttools quartz heater lamps. Remember ===Hardware Details===*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure*Chamber capacity: single wafer*Configured with a load lock*Sample heating – up to 500°C* Power specs**Five 3” Sputtering Guns**2 DC and 2 RF power supply (one for sample bias) ===Substrate Requirements===*Sample sizes: pieces, up to make this visible6” wafers.*Wafer holders available for 2", 3", 4", you must set Sharing 6"; as well as clip fixtures for the smaller pieces** Diameter 150 mm maximum** Substrates up to 4 mm Thick. With special fixture up to 8 mm.** [https://docs.google.com/document to "Anyone with /d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting] ===Material Restrictions===The Lab 18-2 is the link can view"sole sputtering tool for precious metal materials. -->{{material restrictions}} == Detailed Operating Procedure =={{#widget:GoogleDoc|key=1tXD5ABUT7U9eY8iZhgvfND5XGPfkHmby6O6Tp1R_uj2oR6XJHc4D-J8opSyOfX-9bU1AXjf9-9ZVN3Jsln4c_o}}<br>
==Checkout Procedure==
The Lab 18-2 is on the [[LNF Scheduler]]. LNF constituents may reserve time on the tool, and even request staff support for process development.
<!-- This is an example of a chart published with etch data. You can just replace the url with your own. -->
For more details, see [[KJLC Sputter Tool Access and Training]].
# Complete the online [https://rise.articulate.com/share/Ao7oMeRC8efjEeqElzqlBiPE6uyJ9y-T#/ PVD Rise Training] (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)# Read through this Wiki page and the Standard Operating Procedure above.<!--# Complete the training request form Create a [<link> here]http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact. -->aspx?tabindex=3&path=0:0:0:{{# Create a helpdesk ticket var:toolid}} Helpdesk Ticket] requesting training. # A tool engineer or user services member will schedule contact you for a time for initial trainingsession.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
<!--# Complete the SOP quiz [<link> here]https://docs.google. com/forms/d/e/1FAIpQLSevGEsCoP5aNyADbDpt3_7tflfn_1mZNA-->EM2lOOA0doqYbyw/viewform?embedded=true#start=embed| Lab 18 User Training Quiz]# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the toolat the "user" level. ==Maintenance==The sputter shield cleaning procedure is provided below. The source shields are stored on the rack between the Lab 18s when they are not installed. Some films that build up on the shield risk flaking off and shorting out plasma (W-Ti and ITO are the most frequent offenders). This procedure mitigates that, so it is posted here to empower users.
<!--[https://docs.google.com/document/d/1TZFJKKvrBdjAQzsVgegt7mPrAVCy0OPCNOY276lf9vc/edit?usp==Tool Qualification== --><!-- Describe standard maintenance/qualification tests here -->sharing| Lab 18 Shield Cleaning Procedure]
==Maintenance==
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreUser
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