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PVD 75 Proline

36 bytes removed, 2 years ago
==Announcements==
<!-- *Update this with announcements as necessary -->
 
*The target change process on this tool is a user supported process. That can be completed during the tool reservation when the chamber is vented to load samples.
==Capabilities==
 * Computer controlled recipes * Non load lock configuration* limited film stress versatility with in film development.* Reactive film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
==System Overview==
===Hardware Details===
 *Cryo pumped chamber – upper lower 10<sup>-76</sup> Torr base pressure
*Chamber capacity: single wafer
*Configured with port for future load lock
===Substrate Requirements===
 
*Sample sizes: pieces, up to 6” wafers.
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
** Diameter 150 mm maximum** Substrates up to 4 mm Thick. With special fixture up to 8 mm.** [https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
===Material Restrictions===
{| class="wikitable" border="1"
|-
! Material! Max thickness (Run/Reservation)!
|-
| Aluminum ([[Aluminum|Al]])| 3000Å / 1 µm
|-
| Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])| 500Å / 3000Å
|-
| Chrome ([[Chrome|Cr]])| 3000Å / 9000Å
|-
<!--| Copper ([[Copper|Cu]])
| 5000Å / NA
|--->
| Iron ([[Iron|Ir]])| 2000Å / 6000Å
|-
| Nickel ([[Nickel|Ni]])| 2000 Å / 6000Å
|-
<!--| Molybdenum ([[Molybdenum|Mo]])
| 5000 Å / 1 µm
|--->
| Silver ([[Silver|Ag]])| 3000 Å / 6000Å
|-
| Silicon ([[Silicon|Si]])| 3000 Å / 6000Å
|-
| Silicon Dioxide ([[Silicon Dioxide|SiO<sub>2</sub>]])| 1000 Å / 3000Å
|-
| Silicon Nitride ([[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]])| 500 Å / 1000Å
|-
<!--| Tantalum ([[Tantalum|Ta]])
| 2000 Å / NA
|--->
| Titanium ([[Titanium|Ti]])| 3000 Å / 6000 Å
|-
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
| 2000 Å / 5000 Å
|--->
| Tungsten ([[Tungsten|W]])| 3000 Å / 9000 Å
|-
<!--| Tungsten/Titanium ([[Tungsten/Titanium|W-Ti]])
For more details, see [[KJLC Sputter Tool Access and Training]].
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
 # Complete the following items
#*Read the Standard Operating Procedure above
#*Review all of the Wiki pages associated with this tool
<!--==#*<iframe src="https://docs.google.com/presentation/d/1nO94aGlw5j6rmivVmY-nPCghMDGjSD-8RN413huMWmI/embed?start=true&loop=false&delayms=3000" frameborder="0" width="480" height="299" allowfullscreen="true" mozallowfullscreen="true" webkitallowfullscreen="true"></iframe>==-->
<!--# Complete the training request form [<link> here]. -->
# Create a helpdesk ticket requesting training. # A tool engineer will schedule a time for initial training.# Practice with your mentor or another authorized user until you are comfortable with tool operation.
<!--# Complete the SOP quiz [<link> here]. -->
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
<!--==Tool Qualification== -->
OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser
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