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PVD 75 Proline

302 bytes removed, 6 months ago
{{infobox equipment
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
|materials = [[Aluminum|Al]], [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]], [[Chromium|Cr]], [[Copper|Cu]],[[Cobalt|Co]],[[Iron|Fe]], [[Nickel|Ni]],[[Molybdenum|Mo]], [[Silicon|Si]], [[Silicon Dioxide|SiO<sub>2</sub>]], [[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Silver|Ag]],[[Titanium|Ti]],[[Tungsten|W]]
|mask =
|size = 150mm x 4mm and smaller samples
<!-- *Update this with announcements as necessary -->
*The target change process on this tool is a user supported process[https://docs. That can be completed during the tool reservation when the chamber is vented to load samplesgoogle.com/spreadsheets/d/1yMY0SG8PDlF4UWxz96uJVnmP9mcxYr0wGc1xmzmgF48/edit#gid=1886308597| LNF Sputter Calendar]
==Capabilities==
*Reactive film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
==System OverviewSupported Processes==The PVD 75 has a 14" square-shaped chamber high vacuum process chamber. The tools four Tourus Mag Kepper magnetron sputtering sources are set up to allow for RF, DC, Pulse DC and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 350°C is achieved by using the tools quartz heater lamps. The average run time on this tool per wafer is about two hours. ===Hardware Details=== *Cryo pumped chamber – lower 10<sup>-6<[[{{BASEPAGENAME}}/sup> Torr base pressure*Chamber capacity: single wafer*Configured with port for future load lock*Sample heating – up to 350°C**Four 3” Sputtering Guns**2 DC (one pulse DC source) and 2 RF power supply (one for sample RF bias) ===Substrate Requirements===Processes]]
*Sample sizes: pieces, up to 6” wafers.
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
**Diameter 150 mm maximum
**Substrates up to 4 mm Thick. With special fixture up to 8 mm.
**[https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
 
===Material Restrictions===
{{material restrictions}}
 
==Supported Processes==
Basic "User" access with the Lab 18's provide researchers the ability to load, transfer samples, and deposit standard characterized materials. For more details, see [[{{BASEPAGENAME}}/Processes]].
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes.
If you have a material deposition need that is not listed, check to see if this material is deposited on another PVD tool or see more about options for running your own private material on the [[LNF PVD Films|LNF PVD Films]] page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to [http://lnf-wiki.eecs.umich.edu/wiki/LNF_PVD_Films#Requesting_to_Add_New_PVD_Materials Request New PVD Films] here. See more on how to request new sputter sources specifically on the [https://lnf-wiki.eecs.umich.edu/wiki/LNF_Sputter_Adding_New_Films LNF Sputter Adding New Films] page.
===Process Name===
|500Å / 3000Å
|-
|Chrome Chromium ([[ChromeChromium|Cr]])
|3000Å / 9000Å
|-
| 5000Å / NA
|--->
|Iron ([[Iron|IrFe]])
|2000Å / 6000Å
|-
|2000 Å / 6000Å
|-
<!--| Molybdenum ([[Molybdenum|Mo]])| 2000 3000 Å / 8000 Å
|--->
<!--| Platinum ([[Platinum|Pt]])
|--->
|}
 
==System Overview==
The PVD 75 has a 14" square-shaped chamber high vacuum process chamber. The tools four Tourus Mag Kepper magnetron sputtering sources are set up to allow for RF, DC, Pulse DC and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 350°C is achieved by using the tools quartz heater lamps. The average run time on this tool per wafer is about two hours.
 
===Hardware Details===
 
*Cryo pumped chamber – lower 10<sup>-6</sup> Torr base pressure
*Chamber capacity: single wafer
*Configured with port for future load lock
*Sample heating – up to 350°C
**Four 3” Sputtering Guns
**2 DC (one pulse DC source) and 2 RF power supply (one for sample RF bias)
 
===Substrate Requirements===
 
*Sample sizes: pieces, up to 6” wafers.
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
**Diameter 150 mm maximum
**Substrates up to 4 mm Thick. With special fixture up to 8 mm.
**[https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
 
===Material Restrictions===
{{material restrictions}}
==Standard Operating Procedure==
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=1WXj9Ykp4t0WAS3hdYazaYHId4eNTV7hPJ0_bKtfasjE1vf2enLWa1qMT0sAis9bUFoyuTnNjLszRxbj0Rkh4trw}}
==Checkout Procedure==
The PVD 75 is on the [[LNF Scheduler]]. LNF constituents may reserve time on the tool, and even request staff support for process development.
For more details, see [[KJLC Sputter Tool Access and Training]].
<!-- This is an example a chart published with etch data. You can just replace the url with your own. --> #Complete the following items#*Read the Standard Operating Procedure above#*Review all of the Wiki pages associated with this tool#*online [https://docsrise.googlearticulate.com/presentation/dshare/1nO94aGlw5j6rmivVmYAo7oMeRC8efjEeqElzqlBiPE6uyJ9y-nPCghMDGjSD-8RN413huMWmIT#/edit?usp=sharing| PVD 75 Tool VerificationRise Training](this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)#*[https://docs.googleRead through this Wiki page and the Operating Procedure above.com/document/d/1vf2enLWa1qMT0sAis9bUFoyuTnNjLszRxbj0Rkh4trw/edit?usp=sharing| PVD 75 User Detailed Procedure]#*Create a [httpshttp://docsssel-sched.eecs.googleumich.com/forms/d/e/1FAIpQLSejdgAcE9d7_fgmUWHDxykaoB4GpflVnP9anXV2gMXnoUscGw/viewform?embedded=true#start=embed| PVD 75 User Training Quiz]<!--==#*<iframe src="https:edu/sselScheduler/docs.googleResourceContact.com/presentation/d/1nO94aGlw5j6rmivVmY-nPCghMDGjSD-8RN413huMWmI/embedaspx?starttabindex=true3&looppath=false&delayms=3000" frameborder="0" width="480" height="299" allowfullscreen="true" mozallowfullscreen="true" webkitallowfullscreen="true"></iframe>==--><!--:0:0:{{# Complete the training request form [<link> herevar:toolid}} Helpdesk Ticket]. -->#Create a helpdesk ticket requesting training.#A tool engineer or user services member will schedule contact you for a time for initial trainingsession.#Practice with your mentor or another authorized user until you are comfortable with tool operation.<!--# Complete the SOP quiz [<link> herehttps://docs.google.com/forms/d/e/1FAIpQLSejdgAcE9d7_fgmUWHDxykaoB4GpflVnP9anXV2gMXnoUscGw/viewform?embedded=true#start=embed| PVD 75 User Training Quiz]. -->#Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the toolat the "user" level<!--==Tool Qualification== --><!-- Describe standard maintenance/qualification tests here -->
==Maintenance==
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreUser
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