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Created page with "<!-- This should be created as a sub-page of a tool and list the processes available on the tool, which can then be detailed in individual process sub-pages --> Category:Pro..."
<!-- This should be created as a sub-page of a tool and list the processes available on the tool, which can then be detailed in individual process sub-pages -->
[[Category:Processes]]
{{#allow-groups:user}}
[[{{PAGENAME}}]] is a [[physical vapor deposition]] method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically [[argon]]). The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.
==Equipment==
The LNF has 4 sputter deposition tools
* [[Endeavor_M1_AlN_Sputter_Tool|Endeavor M1 Aluminum Nitride Sputter Tool]]
* [[Lab 18-1|Lab 18-1]]
* [[Lab 18-2|Lab 18-2]]
* [[PVD 75 Proline|PVD 75]]
==Method of operation==
==Applications==
{{expand section}}
==Figures of merit==
=See also==
* [[Physical vapor deposition]]
==References==
<references />
-->
==Further reading==
[[Category:Processes]]
{{#allow-groups:user}}
[[{{PAGENAME}}]] is a [[physical vapor deposition]] method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically [[argon]]). The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.
==Equipment==
The LNF has 4 sputter deposition tools
* [[Endeavor_M1_AlN_Sputter_Tool|Endeavor M1 Aluminum Nitride Sputter Tool]]
* [[Lab 18-1|Lab 18-1]]
* [[Lab 18-2|Lab 18-2]]
* [[PVD 75 Proline|PVD 75]]
==Method of operation==
==Applications==
{{expand section}}
==Figures of merit==
=See also==
* [[Physical vapor deposition]]
==References==
<references />
-->
==Further reading==
