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Plasma etching

43 bytes added, 2 years ago
Reactive ion etching (RIE) is one of the most common forms of [[plasma etching]]. It typically uses a combination of chemically reactive elements and energetic ions to etch the desired material. One major advantage to RIE over other forms of etching is that the process can be designed to be highly [[Isotropy|anisotropic]], allowing for much finer resolution and higher aspect ratios.
{{:Reactive ion etching}}
==Plasma ashing==
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