* limited film stress versatility with in film development.
* Reactive Film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
The Lab 18-2 has a 18" D-shaped chamber with a load lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 500C is achieved by using the tools quartz heater lamps.
*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure
*Chamber capacity: single wafer
*Configured with a load lock
*Sample heating – up to 500°C
* Power specs
**Five 3” Sputtering Guns
**2 DC and 2 RF power supply (one for sample bias)
*Sample sizes: pieces, up to 6” wafers.
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
** Diameter 150 mm maximum
** Substrates up to 4 mm Thick. With special fixture up to 8 mm.
** [https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
The Lab 18-2 is the sole sputtering tool for precious metal materials.
==Standard Operating Procedure==