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Lab 18-2

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[[Sputter_deposition|< Sputter deposition]]
<!-- Set the resource ID, 5 digit # found on the scheduler -->
{{#vardefine:toolid|61081}}
<!-- Set the Process Technology (see subcategories on Equipment page) -->
{{#vardefine:technology|PVD}}
<!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals -->
{{#vardefine:restriction|3}}
{{infobox equipment
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
|mask =
|size = 150mm x 4mm and smaller samples
|gases = [[Ar]], [[N2|N<sub>2</sub>]], [[O2|O<sub>2</sub>]]
|overview = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1UZYJ8unAjQOIJ3nJpa1fwXxYKMyW12k6eDR-A-P6fIE/preview System Overview]-->
|sop = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1EPC0U7RQCQLbFe4fL90aMUlLz-fydskqWrUs4hVPpbM/preview SOP]-->
|processes = [[{{PAGENAME}}/Lab 18-2#Supported Processes|Supported Processes]]|userprocesses = [[LNF_User:Lab_18-2_User_Processes|User Processes]]
}}
<!-- Insert the tool description here -->Lab 18-2 is a magnetron [[Sputter_deposition|sputter deposition]] tool used for '''depositing''' '''common and precious metalsthe application of very thin films; 10-2000nm.''' Sputter deposition This tool is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported set up to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, Wdeposit metals including; Au, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxidePt, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact Cr and insulating layers over featuresW among others
==Announcements==
<!-- *Update this with announcements as necessary -->
*Materials are changed every Monday
*The target configuration has been moved to the Supported Process section below{{#widget:Iframe|url=https://docs.google. Follow the link to Lab 18com/spreadsheets/d/e/2PACX-21vRlmI6w0KI2KXYHH8xyUxhCIDwpUBR0qohNJR61GuVr64OLT9rNYjGCAQ0o9XEGKd2QPwqdJ6uVdsB4/Processespubhtml?gid=1242670380&amp;single=true&amp;widget=true&amp;headers=false|width=900|height=500|border=0}} [https://docs.google. On that page under the Target com/spreadsheets/d/1yMY0SG8PDlF4UWxz96uJVnmP9mcxYr0wGc1xmzmgF48/edit#gid=1242670380| Calendar header is the link to the calendar.Link]*Need a different metal? Request it with Helpdesk!
==Capabilities==
 *Computer controlled recipes*Load lock supported processing*limited Limited film stress versatility with in film development.*Reactive Film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
==Supported Processes==
*[[{{BASEPAGENAME}}/Processes]]
Basic "User" access with the Lab 18's provide researchers with the ability to load, transfer samples, and deposit standard characterized materials. For more details such as standard recipe parameters and sidewall coverage (limited data), see [[{{BASEPAGENAME}}/Processes]].
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes.
If you have a material deposition need that is not listed, check to see if this material is deposited on on another PVD tool on the [[LNF PVD Films|LNF PVD Films]] page, or see more about options for running your own private material on the [[LNF {{BASEPAGENAME}}/Processes#Target_Calendar|Target configuration]] section of the {{BASEPAGENAME}}/Processes page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to [http://lnf-wiki.eecs.umich.edu/wiki/LNF_PVD_Films#Requesting_to_Add_New_PVD_Materials Request New PVD Films|] here. See more on how to request new sputter sources specifically on the [https://lnf-wiki.eecs.umich.edu/wiki/LNF_Sputter_Adding_New_Films LNF PVD Sputter Adding New Films]] page.
===Process Name===
{| class="wikitable" border="1"
|-
!Material!Max thickness (Run/Reservation)!
|-
|Aluminum ([[Aluminum|Al]])|5000Å / 1 µm
|-
<!--| Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])
| 1000Å / NA
|-->
|Chrome Chromium ([[ChromeChromium|Cr]])|2000Å / NA
|-
<!--| Copper ([[Copper|Cu]])
| 4000 Å / NA
|--->
|Gold ([[Gold|Au]])|3000Å / 5000Å
|-
<!--| Iron ([[Iron|Ir]])
| 1000Å / 5000Å
|--->
|Nickel ([[Nickel|Ni]])|2000 Å / 5000Å
|-
<!--| Molybdenum ([[Molybdenum|Mo]])
| 2000 Å / 8000 Å
|--->
|Platinum ([[Platinum|Pt]])|1000 Å / 5000Å
|-
<!--| Silver ([[Silver|Ag]])
| 2000 Å / NA
|--->
|Titanium ([[Titanium|Ti]])|3000 Å / 5000 Å
|-
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
| 2000 Å / 5000 Å
|--->
|Tungsten ([[Tungsten|W]])|3000 Å / 9000 Å
|-
|Tungsten/Titanium ([[Tungsten/Titanium|W-Ti]])|3000 Å / 9000 Å
|-
|}
===Hardware Details===
 
*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure
*Chamber capacity: single wafer
*Configured with a load lock
*Sample heating – up to 500°C
*Power specs
**Five 3” Sputtering Guns
**2 DC and 2 RF power supply (one for sample bias)
===Substrate Requirements===
 
*Sample sizes: pieces, up to 6” wafers.
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
**Diameter 150 mm maximum**Substrates up to 4 mm Thick. With special fixture up to 8 mm.**[https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
===Material Restrictions===
{{material restrictions}}
==Standard Detailed Operating Procedure==<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->{{#widget:GoogleDoc|key=1tXD5ABUT7U9eY8iZhgvfND5XGPfkHmby6O6Tp1R_uj2oR6XJHc4D-J8opSyOfX-Xjf9-9bU1A9ZVN3Jsln4c_o}}<br>
==Checkout Procedure==
The Lab 18-2 is on the [[LNF Scheduler]]. LNF constituents may reserve time on the tool, and even request staff support for process development.
<!-- This is an example of a chart published with etch data. You can just replace the url with your own. -->
For more details, see [[KJLC Sputter Tool Access and Training]].
# Complete the online [https://rise.articulate.com/share/Ao7oMeRC8efjEeqElzqlBiPE6uyJ9y-T#/ PVD Rise Training] (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)
# Read through this Wiki page and the Operating Procedure above.
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training
# A tool engineer or user services member will contact you for a training session.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
# Complete the [https://docs.google.com/forms/d/e/1FAIpQLSevGEsCoP5aNyADbDpt3_7tflfn_1mZNA-EM2lOOA0doqYbyw/viewform?embedded=true#start=embed| Lab 18 User Training Quiz]
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool at the "user" level.
#Read through ==Maintenance==The sputter shield cleaning procedure is provided below. The source shields are stored on the Standard Operating Procedure above.<!--# Complete rack between the training request form [<link> here]. -->#Create a helpdesk ticket requesting training.#A tool engineer will schedule a time for initial training.#Practice with your mentor or another authorized user until you Lab 18s when they are comfortable with tool operationnot installed.<!--# Complete Some films that build up on the SOP quiz [<link> here]. shield risk flaking off and shorting out plasma (W-->#Schedule a checkout session with a tool engineer via Ti and ITO are the helpdesk ticket systemmost frequent offenders). If this checkout This procedure mitigates that, so it is successful, the engineer will authorize you on the toolposted here to empower users.
<!--[https://docs.google.com/document/d/1TZFJKKvrBdjAQzsVgegt7mPrAVCy0OPCNOY276lf9vc/edit?usp==Tool Qualification== --><!-- Describe standard maintenance/qualification tests here -->sharing| Lab 18 Shield Cleaning Procedure]
==Maintenance==
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreUser
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