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Lab 18-2

390 bytes added, 2 years ago
Undo revision 17288 by Saedwar (talk)
[[Sputter_deposition|< Sputter deposition]]
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|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
<!-- Insert the tool description here -->Lab 18-2 is a magnetron [[sputter deposition]] tool for '''depositing''' '''common and precious metals.''' Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features. 
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*The target configuration has been moved to the Supported Process section below. Follow the link to Lab 18-2/Processes. On that page under the Target Calendar header is the link to the calendar.
 *Computer controlled recipes*Load lock supported processing*limited film stress versatility with in film development.*Reactive Film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
==Supported Processes==
{| class="wikitable" border="1"
!Material!Max thickness (Run/Reservation)!
|Aluminum ([[Aluminum|Al]])|5000Å / 1 µm
<!--| Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])
| 1000Å / NA
|Chrome ([[Chrome|Cr]])|2000Å / NA
<!--| Copper ([[Copper|Cu]])
| 4000 Å / NA
|Gold ([[Gold|Au]])|3000Å / 5000Å
<!--| Iron ([[Iron|Ir]])
| 1000Å / 5000Å
|Nickel ([[Nickel|Ni]])|2000 Å / 5000Å
<!--| Molybdenum ([[Molybdenum|Mo]])
| 2000 Å / 8000 Å
|Platinum ([[Platinum|Pt]])|1000 Å / 5000Å
<!--| Silver ([[Silver|Ag]])
| 2000 Å / NA
|Titanium ([[Titanium|Ti]])|3000 Å / 5000 Å
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
| 2000 Å / 5000 Å
|Tungsten ([[Tungsten|W]])|3000 Å / 9000 Å
|Tungsten/Titanium ([[Tungsten/Titanium|W-Ti]])|3000 Å / 9000 Å
===Hardware Details===
*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure
*Chamber capacity: single wafer
*Configured with a load lock
*Sample heating – up to 500°C
*Power specs
**Five 3” Sputtering Guns
**2 DC and 2 RF power supply (one for sample bias)
===Substrate Requirements===
*Sample sizes: pieces, up to 6” wafers.
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
**Diameter 150 mm maximum**Substrates up to 4 mm Thick. With special fixture up to 8 mm.**[|Sputter Sample Mounting]
===Material Restrictions===
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For more details, see [[KJLC Sputter Tool Access and Training]].
 #Read through the Standard Operating Procedure above.
<!--# Complete the training request form [<link> here]. -->
#Create a helpdesk ticket requesting training.#A tool engineer will schedule a time for initial training.#Practice with your mentor or another authorized user until you are comfortable with tool operation.
<!--# Complete the SOP quiz [<link> here]. -->
#Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
<!--==Tool Qualification== -->
OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser


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