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Plasmatherm 790

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The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for [[Reactive ion etching|reactive ion etching (RIE)]] while the right chamber is configured for [[PECVD|plasma enhanced chemical vapor deposition (PECVD)]]. The RIE chamber is significantly slower than other etchers available in the lab, allowing greater depth control on thin films. The PECVD chamber is also designed to deposit at a lower rate than the [[GSI PECVD]] and [[P5000 PECVD]] - the smaller building blocks help improve film quality. This tool has almost no material restrictions, allowing a wide variety of processing.
==Announcements==
*[2014-09-25] - Added 500 sccm Helium MFC to PECVD chamber.
==Capabilities==
OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Bureaucrats, Interface administrators, Administrators, Widget editors
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