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Plasmatherm 790/Processes/L ox200

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|authors =
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==Capabilities==
{| class="wikitable" border="1" style="text-align: center"
|-
! Parameter
!
|-
| Deposition Rate
| 7.5 Å/sec
|-
| Index of Refraction
| 1.466
|-
| Stress
| -325 MPa
|-
|}
==Parameters==
|}
==Capabilities==
{| class="wikitable" border="1" style="text-align: center"
|-
! Parameter
!
|-
| Deposition Rate
| 7.5 Å/sec
|-
| Index of Refraction
| 1.466
|-
| Stress
| -325 MPa
|-
|}
This process is qualified with a 5 min run. The max allowed thickness is 2µm.
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