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SB-6E Bonder

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This tool is used to bond 4" wafers, (and in some circumstances be configured for 6" wafers). It is primarily used for [[Anodic bonding|anodic bonding]] and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.
==Announcements==
* None at this time
==Capabilities==
* Chamber vacuum below 5.0e-5 mbar easily achieved
* Tool force of 30 kN
* Max chuck temp of 550°C500°C
* Substrate stack thicknesses of 500 um to 5 mm possible. Thinner or thicker with tool engineer approval.
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