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Plasma etching

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{{:Reactive ion etching}}
==Deep reactive ion etching==
{{main|Deep reactive ion etching}}
Deep reactive ion etching (DRIE) is a term used to describe RIE processes that are designed to achieve high (>10:1) aspect ratios or etch depths greater than several microns. One common process is the [[Wikipedia:Bosch process|Bosch process]].
 
{{:Deep reactive ion etching}}
==Plasma ashing==
{{main|Plasma ashing}}
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